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Thin-film production method and production device

A manufacturing method and a manufacturing device technology, which are applied in the field of thin film manufacturing and manufacturing devices, can solve problems such as heat and substrate cooling, achieve high cooling capacity, suppress the deterioration of vacuum degree, and realize the effects of cooling capacity

Inactive Publication Date: 2013-11-13
PANASONIC CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As factors that determine whether such continuous thin film production can be performed, there are issues of heat during film formation and substrate cooling.

Method used

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  • Thin-film production method and production device

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Embodiment Construction

[0038] Hereinafter, for embodiments of the present invention, while referring to the attached Figure 1 Side note.

[0039] Such as figure 1 As shown, 100 A of manufacturing apparatuses of a thin film are equipped with the vacuum tank 22, the conveyance system 40, the evaporation source 9 (film formation source), and the coater 11 (coater). The evaporation source 9 , the transport system 40 and the coater 11 are arranged inside the vacuum tank 22 . Before forming a thin film on the first main surface of the substrate 21 , the substrate cooling material 10 is applied to the second main surface of the substrate 21 by the coater 11 . The substrate cooling material 10 is evaporated by heat applied to the substrate 21 when forming a thin film on the substrate 21 . The substrate 21 is cooled by the vaporization heat of the substrate cooling material 10 . Accordingly, it is possible to prevent the substrate 21 from being damaged by heat.

[0040] The vacuum chamber 22 is constit...

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Abstract

This thin film production device (100A) is provided with a vacuum tank (22), a deposition source (9) (evaporation source), a conveyance system (40), and a coater (11). The deposition source (9) is used to form a thin film on a first principle surface of a substrate (21) in a deposition region (31) in the vacuum tank (22). The conveyance system (40) is responsible for conveying the substrate (21) from an unwinding roller (23) (initial position) to a winding roller (26) (recovery position) along a conveyance path installed such that the substrate (21) passes through the deposition region (31). When forming the thin film, the coater (11) applies to a second principle surface of the substrate (21) a substrate cooling material (10) which can be evaporated through the application of heat to the substrate (21).

Description

technical field [0001] The present invention relates to a thin film manufacturing method and manufacturing device. Background technique [0002] Thin-film technology is being widely developed for higher performance and miniaturization of devices. In addition, the thinning of devices is not limited to direct value to users, but also plays an important role from environmental aspects such as protection of earth resources and reduction of power consumption. [0003] In the progress of such thin-film technology, it is essential to meet the requirements from the aspect of industrial utilization such as high efficiency, stability, high productivity, and low cost of thin-film production, and efforts in this direction are continuing. [0004] In order to increase the productivity of thin films, a film-forming technique with a high deposition rate is required. In thin film production including vacuum evaporation method, sputtering method, ion plating method, CVD method (chemical va...

Claims

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Application Information

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IPC IPC(8): C23C14/24H01M4/1395H01M4/04H01M4/139
CPCC23C14/24Y02E60/122H01M4/0426H01M4/1395C23C14/562C23C14/541Y02E60/10
Inventor 本田和义冈崎祯之末次大辅
Owner PANASONIC CORP
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