Method for making patterning conducting layer

Abstract

Discloses is a method for making a patterning conducting layer, and the method comprises steps of: (A) draping a base material with a first conducting layer; (B) forming a layer of protective film on the surface of a first conducting zone of the first conducting layer; (C) draping with a second conducting layer, and the second conducting layer comprises a to-be-removed zone and a pattern-forming zone. (D) removing the protective film to expose the first conducting zone; (E) etching the pattern-forming zone of the second conducting layer and the first conducting layer to form a pattern. Before the second conducting layer is formed, the first conducting layer is shielded by the protective film at first, and then the protective film is removed so as to make the to-be-removed zone be removed together. In this way, only one time of photolithographic etching is capable of completing the making of two conducting layers, thereby simplifying processing steps and shortening processing time.

Description

technical field [0001] The invention relates to a method for making a patterned conductive layer, in particular to a method for plating at least two conductive layers on the surface of a base material and patterning the conductive layer. Background technique [0002] refer to figure 1 It is known that the plastic substrate 11 applied to electronic equipment, such as the substrate 11 of a touch panel, is usually coated with functional plastic on the surface of the substrate 11 in conjunction with a roll-to-roll process. Conductive thin film, and then etch the conductive thin film into the required pattern, as the electrode wire for transmitting the control signal. [0003] The specific manufacturing process is as follows: a layer of transparent first conductive layer 12 is plated on the surface of an operation area 111 and a wiring area 112 of the substrate 11 , and then a layer of second conductive layer 13 is plated. Since the operating area 111 is the operating area of ​...

AI Technical Summary

Problems solved by technology

[0005] The photolithographic etching process includes the steps of coating photoresist, covering photomask, exposing, removing photomask and developing, and removing photoresist. The steps are complicated and take a lot of time. What's more, the above-mentioned process has undergone two photolithography etchings in total, which makes the whole process too complicated and time-consuming

Moreover, when removing the second conductive layer 13 of the operating region 111 by the second photolithography etching, the second conductive layer 13 on the wiring region 112 must be shielded and protected, which also causes difficulty and complexity of the process.

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