Halogen-free low-temperature tinol

Abstract

The invention discloses halogen-free low-temperature tinol which comprises the following components by mass percent: 85-95% of solder powder and 5-15% of scaling powder, wherein the solder powder is Sn-Bi series solder powder, and the scaling powder comprises the following components by mass percent: 35-45% of solvent, 35-45% of film forming agent, 5-10% of active agent, 1-5% of thixotropic agent, 1-2% of antioxygen and 1-3% of the balance. With the adoption of the mode, the stability of the tinol can be improved; the tinol has very high wetting power and a very high expansion rate; and no residue is remained after soldering.

Description

technical field [0001] The invention relates to the field of solder paste, in particular to a halogen-free low-temperature solder paste. Background technique [0002] With the implementation of lead-free electronic products, Sn-Bi series solder has the characteristics of being able to prepare alloys in a wide temperature range from 138°C eutectic point to 232°C, and can be assembled at about 160°C. -Compared with traditional SnPb solder, Bi series solder has the same elastic modulus in a wide temperature range, and its tensile strength and creep resistance are even better than the latter. Coupled with its moderate price and abundant raw materials, it can quickly replace SnPb solder in low-temperature assembly occasions and become the main substitute for low-temperature brazing. [0003] However, most of the activators currently used to prepare the solder paste contain amine salts of halogens, which leave a lot of residue after soldering and are easily ionized, which has pot...

AI Technical Summary

Problems solved by technology

[0003] However, most of the active agents currently used to prepare the solder paste contain amine salts of halogens, which leave a lot of residue after soldering and are easily ionized, which has potential adverse effects on the mechanical and electrical properties of the product