Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method for metamaterial board, metamaterial antenna housing and manufacturing method for metamaterial antenna housing

A manufacturing method and metamaterial technology, applied in the field of metamaterials, can solve problems such as complex processing processes, and achieve the effect of simple process, superior mechanical properties, and not easy to wear

Active Publication Date: 2013-09-11
KUANG CHI INST OF ADVANCED TECH
View PDF4 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, people periodically arrange metal microstructures with a certain geometric shape on a dielectric substrate to form metamaterials. However, the processing process is complicated, and there are also great limitations in the size of the metal microstructures that can be processed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method for metamaterial board, metamaterial antenna housing and manufacturing method for metamaterial antenna housing
  • Manufacturing method for metamaterial board, metamaterial antenna housing and manufacturing method for metamaterial antenna housing
  • Manufacturing method for metamaterial board, metamaterial antenna housing and manufacturing method for metamaterial antenna housing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Such as Figure 1 to Figure 3 Shown is an embodiment of the manufacturing method of the metamaterial sheet of the present invention and an example of the supermaterial sheet made therefrom, the embodiment includes the following steps:

[0045] Step 102: Making the prepreg 10 by using the glass fiber cloth 12 impregnated with the thermosetting synthetic resin solution.

[0046] Step 104 : attaching a plurality of metal microstructures 14 on the prepreg 10 . figure 2 and image 3 Shown in is only an example of the metal microstructure 14, in fact, the geometric size and shape of the metal microstructure 14 can be changed arbitrarily according to the electromagnetic response to be achieved, and the arrangement of the plurality of metal microstructures 14 The way of cloth can also be changed arbitrarily.

[0047] Step 106: Place the prepreg 10 attached with the metal microstructure 14 between two other glass fiber cloths 20 impregnated with a thermosetting synthetic res...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a manufacturing method for a metamaterial board. The manufacturing method for the metamaterial board comprises the following steps of (1) using a piece of glass fiber cloth which has been dipped in a thermoset synthetic resin solution to manufacture a semi-solidified piece, (2) attaching a plurality of metal microstructures to the semi-solidified piece, (3) placing the semi-solidified piece with the attached metal microstructures between two pieces of glass fiber cloth with the thermoset synthetic resin solution in a dipping mode, and (4) carrying out heating and pressurization on the semi-solidified piece with the attached metal microstructures and the two pieces of glass fiber cloth with the thermoset synthetic resin solution in the dipping mode to combine the semi-solidified piece with the attached metal microstructures and the two pieces of glass fiber cloth with the thermoset synthetic resin solution in the dipping mode together in a pressing mode so as to obtain the metamaterial board. The manufacturing method for the metamaterial board is simple in process. Due to the facts that the metal microstructures are protected by the glass fiber cloth with thermoset synthetic resin, and the glass fiber cloth with the thermoset synthetic resin covers the two sides of each metal microstructure, abrasion cannot be easily caused, and good wave-transparent performance can be kept for a long time. The invention further relates to a metamaterial antenna housing made of the metamaterial board, and a manufacturing method for the metamaterial antenna housing.

Description

technical field [0001] The present invention relates to metamaterials, and more specifically, to a method for manufacturing a metamaterial plate, a metamaterial radome and a method for manufacturing the same. Background technique [0002] Metamaterials are artificial composite structural materials with extraordinary physical properties that natural materials do not have. At present, people periodically arrange metal microstructures with a certain geometric shape on a dielectric substrate to form metamaterials. However, the processing process is complicated, and there are also great limitations in the size of the metal microstructures that can be processed. However, because people can use the geometric shape, size and arrangement of metal microstructures to change the permittivity and / or magnetic permeability of each point in space to produce the desired electromagnetic response, it is still expected that future metamaterials will There will be a wide range of application pr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01Q15/00H01Q1/42
Inventor 刘若鹏赵治亚方小伟何雪涵金晶
Owner KUANG CHI INST OF ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products