Method for testing wireless performance of wireless product

Abstract

The invention discloses a method for testing wireless performance of a wireless product. A circuit board of the wireless product comprises a wireless chip, a RF link and an antenna. The method comprises the following steps that (1), a bonding pad between the RF link and the antenna is disconnected when the circuit board is produced, tin paste is brushed on the bonding pad which is connected between the RF link and a wireless testing point; (2), automatic tin connection can be conducted on the bonding pad between the RF link and the wireless testing point by controlling furnace temperature after the circuit board passes through a furnace through an SMT; (3), soldering iron is used for disconnecting the tin connection between the RF link and the wireless testing point after a test is finished, and the soldering iron supplement tin is used for connecting the bonding pad between the RF link and the antenna. The method for testing wireless performance of the wireless product has the advantages of being low in testing cost and reliable in testing results.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a wireless performance testing method of wireless products. Background technique [0002] Many wireless products currently on the market use built-in antenna solutions, such as familiar wireless network cards, wireless routers, etc. When performing production tests on wireless performance of wireless products with built-in antennas, there are currently three main test methods : [0003] Method 1: If figure 1 and figure 2 As shown, for wireless products using this method, the RF link and the antenna need to be connected through a wireless test socket. When testing wireless performance, it is also necessary to buckle the cable line that matches the wireless test socket to test. The working principle of the wireless test socket used in this test method is that the inside of the test socket is connected under normal conditions, that is, the RF link and the antenna are normally...

AI Technical Summary

Problems solved by technology

For this test method, although the accuracy of the test results is improved, the test has a great impact on production efficiency, and the resistance is easily damaged in the process of repeated disassembly and welding, which greatly increases the production test cost.

In addition, under this method, since the electronic device needs to be soldered many times during the test process, it will also affect the device characteristics, resulting in inconsistent RF indicators.

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