Repair method for surface-damaged growth point of melted quartz element
A surface damage and repair method technology, applied in the field of fused silica components, can solve problems such as damage and growth of fused silica components, and achieve the effects of increased growth threshold, high stability, and extended service life
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Embodiment 1
[0030] 1. Sample preparation: ultrasonically clean the fused silica substrate with deionized water, alkaline cleaning agent, and deionized water for 5 minutes each, and dry naturally in a clean room to obtain a clean fused silica element; use Nd with a wavelength of 355 nm : YAG laser irradiates on the surface of the fused silica element to generate damage points. A Leica optical microscope was used to measure the lateral size of the damage point on the surface of the fused silica element, and a Bruker step meter was used to test the longitudinal depth of the damage point. The transverse dimension of the damage point was measured to be 150 microns, and the longitudinal depth was 5 microns.
[0031] 2. Femtosecond laser repair: The femtosecond laser repair device is used to repair the damaged point by "raster scanning". The specific repair process parameters are: laser energy is 70 microjoules, the horizontal distance X of the "raster scanning" movement is 200 microns, the ver...
Embodiment 2
[0036] 1. Sample preparation: ultrasonically clean the fused silica substrate with deionized water, alkaline cleaning agent, and deionized water for 5 minutes each, and dry naturally in a clean room to obtain a clean fused silica element; use Nd with a wavelength of 355 nm : YAG laser irradiates on the surface of the fused silica element to generate damage points. A Leica optical microscope was used to measure the lateral size of the damage point on the surface of the fused silica element, and a Bruker step meter was used to test the longitudinal depth of the damage point. The measured lateral dimension of the damaged spot was 240 microns, and the longitudinal depth was 9 microns.
[0037]2. Femtosecond laser repair: The femtosecond laser repair device is used to repair the damaged point by "raster scanning". The specific repair process parameters are: energy is 80 microjoules, the horizontal distance X of "raster scanning" movement is 300 microns, the vertical distance Y is ...
Embodiment 3
[0042] 1. Sample preparation: ultrasonically clean the fused silica substrate with deionized water, alkaline cleaning agent, and deionized water for 5 minutes each, and dry naturally in a clean room to obtain a clean fused silica element; use Nd with a wavelength of 355 nm : YAG laser irradiates on the surface of the fused silica element to generate damage points. A Leica optical microscope was used to measure the lateral size of the damage point on the surface of the fused silica element, and a Bruker step meter was used to test the longitudinal depth of the damage point. The transverse dimension of the damage point was measured to be 380 microns, and the longitudinal depth was 11 microns.
[0043] 2. Femtosecond laser repair: The femtosecond laser repair device is used to repair the damaged point by "raster scanning". The specific repair process parameters are: energy is 90 microjoules, the horizontal distance X of the "raster scanning" movement is 450 microns, the vertical...
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