Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Filler-textured polymer matrix composite material with high thermal conductivity and preparation method thereof

A technology of composite materials and polymers, applied in the field of high thermal conductivity polymer-based composite materials and their preparation, can solve the problems of low thermal conductivity, achieve excellent thermal conductivity, simple and easy method, and increase the service life

Inactive Publication Date: 2013-07-31
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
View PDF2 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, the thermal conductivity of polymer materials is very low, so if its thermal conductivity can be improved, the heat dissipation problem of the electronic device system will be greatly improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Filler-textured polymer matrix composite material with high thermal conductivity and preparation method thereof
  • Filler-textured polymer matrix composite material with high thermal conductivity and preparation method thereof
  • Filler-textured polymer matrix composite material with high thermal conductivity and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0024] The preparation method of the filler-textured high thermal conductivity polymer-based composite material of the present invention includes: uniformly dispersing micro-nano inorganic powders with two-dimensional geometry in a thermoplastic resin polymer solution, or making the inorganic filler A mixing process in which the powder is uniformly dispersed in the prepolymer / monomer capable of synthesizing the polymer by in-situ polymerization to form a mixture slurry; and a molding method capable of providing directional force to texture the filler A molding process of molding the mixture slurry. The material of the invention uses an organic polymer as a matrix and an inorganic substance as a filler, has high thermal conductivity, and has good processability and flexibility. Among them, the polymers used are most common thermoplastic resins or polymers that can be synthesized by in-situ polymerization. Inorganic fillers are hexagonal boron nitride, graphite, graphite oxide,...

Embodiment 1

[0044] To prepare 3wt% h-BN / polyvinyl alcohol composite material, 0.12g h-BN was mixed with 4g polyvinyl alcohol particles, then 36g water was added, and the mixture was stirred at a constant temperature of 90°C for 300min. After the polyvinyl alcohol is completely dissolved and mixed evenly with h-BN, the viscous mixture is poured on the casting plate for casting, and the casting speed is adjusted to 0.8m / min, and the thickness is 0.4mm. After casting, let it dry naturally for 24 hours and demould. The thermal conductivity of the obtained composite material in the direction parallel to the casting direction is as high as 1.61W / (m k) (LFA447 thermal conductivity meter from NETZSCH Company), which is 16 times higher than that of pure polyvinyl alcohol, and the obtained sample is flexible Excellent sex.

Embodiment 2

[0046] To prepare 10wt% h-BN / polyvinyl alcohol composite material, 0.36g h-BN was mixed with 3.2g polyvinyl alcohol particles, then 36.8g water was added, and the mixture was stirred at a constant temperature of 90°C for 300min. After the polyvinyl alcohol is completely dissolved and mixed evenly with h-BN, the viscous mixture is poured on the casting plate for casting, and the casting speed is adjusted to 0.8m / min, and the thickness is 0.4mm. After casting, let it dry naturally for 24 hours and demould. The thermal conductivity of the obtained composite material in the direction parallel to the casting direction is as high as 3.92W / (m k) (LFA447 thermal conductivity meter from NETZSCH Company), which is 39 times higher than that of pure polyvinyl alcohol, and the obtained sample is flexible Excellent sex.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Particle sizeaaaaaaaaaa
Thermal conductivityaaaaaaaaaa
Login to View More

Abstract

The invention relates to a filler-textured polymer matrix composite material with high thermal conductivity and a preparation method thereof. The preparation method comprises the following steps: 1, a mixing process: uniformly dispersing a micro-nano inorganic filler powdered raw material with anisotropy and two-dimensional geometrical morphology into a solution of a thermoplastic resin polymer raw material or uniformly dispersing the inorganic filler powered raw material into a polymer's performed polymer / monomer raw material solution which can be used to synthesize the polymer by in situ polymerization, and forming a mixture slurry; and 2, a molding process: making the mixed slurry to be molded through a molding method for providing directional acting force to make the filler to be textured.

Description

technical field [0001] The invention relates to a filler textured high thermal conductivity polymer-based composite material and a preparation method thereof, belonging to the field of polymer-based composite materials. Background technique [0002] With the rapid development of microelectronics high-density assembly and integration technology, the assembly density of electronic equipment has been rapidly increased, which will lead to a sharp increase in the heat generated per unit area, resulting in a significant reduction in the working efficiency and service life of electronic components. In order to ensure the normal operation of electronic equipment, excess heat must be removed in a timely manner. Therefore, heat dissipation has become one of the bottlenecks faced by large-scale integrated circuits ([1] Sato, K.; Horibe, H.; Shirai, T.; Hotta, Y.; Nakano, H.; Nagai, H. .; Mitsuishi, K.; Watari, K.J Mater Chem 2010, 20, 2749, [2] Ting, J.M.; Chen, Y.M. Carbon 2002, 40, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08J5/18C08J3/28C08J3/24C08L29/04C08L33/12C08L79/08C08L63/00C09K5/14C08F120/14C08F2/46C08F2/44C08G73/10C08K3/38C08K3/04
Inventor 黄晓谢滨欢张国军
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com