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Manufacture Technology of Boss Printed Board by Addition Method

A technology of manufacturing process and additive method, which is applied in the direction of printed circuit manufacturing, printed circuit, conductive pattern formation, etc., can solve the problems of copper waste, difficult control, complicated process, etc., and achieve the effect of low price, easy control and simple process

Active Publication Date: 2015-11-25
JIANGSU PROVISION ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the semi-etching process is generally used for the boss printed board, that is, the required boss is etched on the thick copper, which belongs to the subtractive method. Not only the process is complicated and difficult to control, but also a large amount of copper is wasted.

Method used

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  • Manufacture Technology of Boss Printed Board by Addition Method
  • Manufacture Technology of Boss Printed Board by Addition Method
  • Manufacture Technology of Boss Printed Board by Addition Method

Examples

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Embodiment Construction

[0026] A manufacturing process of additive boss printed boards. Firstly, the base material is selected as the insulating substrate 1; That is, a layer of copper layer 2 is respectively plated on the upper and lower sides of the insulating substrate (such as figure 2 shown); then carry out pattern transfer and etching / removing film to the copper clad laminate to obtain a PCB board containing the first step 3 (such as image 3 As shown), the metal boss 4 is added on the first step of the PCB board containing the first step using an additive method.

[0027] Preferably, the method of adding the metal boss by the above-mentioned additive method is one of spot tin, spot welding and electroplating.

[0028] Preferably, the above-mentioned point-tin type addition method to add a metal boss includes the following steps: first, on the first step of the PCB board containing the first step, there is no need to add a choke ring 5 at the place where the metal boss is added (such as Fig...

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PUM

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Abstract

The invention discloses a process for manufacturing a boss printed board by means of an addition process. First, a base material is selected as an insulating base board; then, the insulating base board is sequentially subjected to cutting, drilling, hole passing, hole plugging and copper deposition returning / electroplating to form a copper coated board, namely one copper layer is respectively plated on the upper side face and the lower side face of the insulating base board; pattern transfer and etching / film stripping of the copper coated board are performed to obtain a printed circuit board (PCB) including a first step, and a metal boss is added on the first step of the PCB including the first step by means of the addition process. The process is simple and easy to manage and control. In addition, the boss printed board can be manufactured by using common thick copper, and the cost is greatly saved.

Description

technical field [0001] The invention relates to the field of acoustics, mainly earphones or microphones on mobile phones, and in particular to a process for manufacturing a boss printed board by an additive method. Background technique [0002] Electronic products tend to develop in the direction of miniaturization and multi-function, which requires PCB products to continue to develop in the direction of miniaturization and multi-function. [0003] At present, the semi-etching process is generally used for the boss printed board, that is, the required boss is etched on the thick copper, which belongs to the subtractive method. Not only the process is complicated and difficult to control, but also a large amount of copper is wasted. Contents of the invention [0004] In order to overcome the above-mentioned defects, the present invention provides a manufacturing process of additive boss printed boards. This process is not only simple and easy to control, but also can be mad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/10
CPCH05K3/10H05K3/205H05K2203/0502
Inventor 马洪伟
Owner JIANGSU PROVISION ELECTRONICS CO LTD
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