Copper electroplating solution

Abstract

The invention discloses a copper electroplating solution with a formula comprising 5-20 g / L of copper carbonate, 50-200 g / L of tripotassium citrate, 15-30 g / L of sodium nitrite, 5-10 g / L of potassium nitrate, 25-50 g / L of potassium hydroxide, 5-15 g / L of citric acid, and the balance being deionized water. According to the solution, the formula is reasonable, cyanogen-free and nontoxic formula is employed, production is safe without health influences on an operator, and a produced product has good quality.

Description

technical field [0001] The invention relates to a copper electroplating solution. Background technique [0002] At present, metal copper plating is mainly based on cyanide copper plating. The cyanide ion contained in the copper plating solution is a highly toxic substance. The gas released during high-temperature electroplating has an impact on the health of operators, and the waste liquid is difficult to treat and pollutes the environment. Contents of the invention [0003] The purpose of the invention is to provide a copper electroplating solution with reasonable formula, good product quality and non-toxic and pollution-free plating solution. [0004] Technical solution of the present invention is: [0005] A copper electroplating solution is characterized in that: that is, its formula is: copper carbonate 5-20g / L; tripotassium citrate 50-200g / L; sodium nitrite 15-30g / L; potassium nitrate 5-10g / L ; Potassium hydroxide 25-50g / L; citric acid 5-15g / L; the balance deionize...

AI Technical Summary

Problems solved by technology

[0002] At present, metal copper plating is mainly based on cyanide copper plating. The cyanide ion contained in the copper plating solution is a highly toxic substance. The gas released during high-temperature electroplating has an impact on the health of operators, and the waste liquid is difficult to treat and pollutes the environment.