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Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor

A cycloolefin resin and a manufacturing method technology, which are applied in the directions of printed circuit manufacturing, electric solid state devices, semiconductor/solid state device parts, etc., can solve the problem that the resin does not have mold releasability and the like

Inactive Publication Date: 2013-06-26
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this film does not have sufficient releasability from resins used in sealing materials, prepregs, and adhesives

Method used

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  • Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor
  • Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor
  • Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～9 and comparative example 1～4

[0123] Prepare the polymers shown in Table 1. A specific polymer containing an alkyl (meth)acrylate unit having an alkyl group having 3 or more carbon atoms having the mass shown in Table 2 and Table 3 was dissolved in dicyclopentadiene to obtain a reaction stock solution. Then, add the ruthenium catalyst with the structure of formula (7) shown in Table 2 and Table 3 to the above reaction stock solution, mix with a line mixer, and then heat Cast film formation was carried out on a carrier film made of polyethylene terephthalate. Then, it heated at 200 degreeC for 5 minutes in nitrogen atmosphere, and obtained the release film. The results are shown in Table 2 and Table 3.

[0124] [chemical 5]

[0125]

[0126] [Table 1]

[0127]

[0128] Polymer 1: Actoflow (registered trademark) UT-1001 manufactured by Soken Scientific Co., Ltd., the terminal is modified with a hydroxyl group, and the hydroxyl value is 57±2.

[0129] Polymer 2: Refer to Production Example 1

[01...

manufacture example 1

[0135] A monomer mixture consisting of 65% of 2-ethylhexyl acrylate and 35% of styrene and 0.03 part of 2,2'-azobisisobutyronitrile were dissolved in 700 parts of ethyl acetate in the reactor. After nitrogen substitution, polymerization reaction was performed at 80° C. for 6 hours. The polymerization conversion rate was 95%. The obtained copolymer was dried under reduced pressure, ethyl acetate was evaporated, and a viscous solid copolymer was obtained. The weight average molecular weight of the copolymer was 400,000, and the weight average molecular weight / number average molecular weight was 3.1.

manufacture example 2

[0137] A monomer mixture consisting of 25% n-butyl acrylate and 75% styrene and 0.03 part of 2,2'-azobisisobutyronitrile were dissolved in 700 parts of ethyl acetate in the reactor. After nitrogen substitution, polymerization reaction was performed at 80° C. for 6 hours. The polymerization conversion rate was 95%. The obtained copolymer was dried under reduced pressure, ethyl acetate was evaporated, and a viscous solid copolymer was obtained. The copolymer had a weight average molecular weight of 40,000.

[0138] [Table 2]

[0139]

[0140] [table 3]

[0141]

[0142] Ruthenium catalyst: VC843 manufactured by RIMTEC Co., Ltd.

[0143] The release films of Examples 1 to 9 had high releasability and mechanical strength. The release film of Comparative Example 1 obtained by ring-opening metathesis polymerization of a polymerizable composition containing no polymer containing an alkyl group having 3 or more carbon atoms ( Alkyl meth)acrylate units. Although the alkyl ...

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Abstract

This thermosetting crosslinked cycloolefin resin film can be obtained by the ring-opening metathesis polymerization of a polymerizable composition which comprises (a) 100 parts by mass of a cycloolefin monomer and (b) 0.5 to 8 parts by mass of a polymer that comprises 100 to 20 mass% of alkyl (meth)acryrate units wherein the alkyl has three or more carbon atoms and 0 to 80 mass% of aromatic vinyl compound units or alkyl (meth)acrylate units wherein the alkyl has two or less carbon atoms and that has a weight-average molecular weight of 1,000 to 2,000,000.

Description

technical field [0001] The present invention relates to a thermosetting cross-linked cycloolefin resin film and a method for producing the same. The resin film contributes to improvement of the semiconductor sealing process of IC chips, LEDs, etc., the lamination heat-pressing process in the manufacture of multilayer printed wiring boards, flexible printed wiring The yield rate of the mounting process such as the cladding and bonding process during board manufacturing. Background technique [0002] Along with the miniaturization and thinning of mobile devices such as mobile phones, the miniaturization and thinning of semiconductor elements such as IC chips and LEDs are also progressing. The shape of the sealing chip that seals these components is also changing. Recently, chip size packages (CSPs) in which terminals are directly placed on the components are no longer mainstream. ), ball grid array (BGA), quad flat no-lead package (QFN) and other shapes of sealed chips for m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L65/00C08G61/00C08J5/18H01L23/29H01L23/31H05K3/28
CPCC08F283/14C08G61/08C08G2261/3324C08G2261/418C08J5/18C08J2365/00C08L65/00H01L23/293H01L2924/0002H05K1/0373H05K3/281C08L33/06C08F220/10C08F212/02H01L2924/00C08G61/00H01L23/29
Inventor 岩渕智前田耕一郎
Owner ZEON CORP
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