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Packaging process of white light light-emitting diode (LED)

A packaging process, LED chip technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of uneven light spot, phosphor powder distribution, product reliability and brightness influence, etc. Phenomenon improvement effect

Inactive Publication Date: 2013-06-26
BONSHINE OPTICAL ELECTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to technology monopoly, domestic portable flashlight bulbs can only optimize the light spot through the manufacturing process (by adding diffuser powder or using fine phosphor powder), but due to the existing manufacturing process of LED lights, the phosphor powder is not distributed in the direction of the chip light emission. Uniformity leads to the generation of light spots, which affects the reliability and brightness of the product

Method used

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  • Packaging process of white light light-emitting diode (LED)
  • Packaging process of white light light-emitting diode (LED)

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Embodiment Construction

[0023] The present invention will be further described below in conjunction with accompanying drawing and specific embodiment:

[0024] Such as figure 1 , figure 2 Shown, a kind of encapsulation process of white light LED of the present invention, it comprises the steps:

[0025] a. Provide packaging support 1, light-transmitting cover and LED chip. The packaging support is a ceramic type support with a receiving cavity, including a first electrode and a second electrode. The first electrode is a positive pin, and the second The electrode is a negative electrode pin; the light-transmitting cover is a glass lens 2 with a hemispherical structure; the LED chip is a blue LED flip-chip 3 .

[0026] b. Solid crystal, fix the blue LED flip chip on the center surface of the bottom center of the housing cavity of the packaging bracket 1, and fix the blue LED flip chip 2 and the packaging bracket 1 with insulating glue, because the blue LED flip chip The chip is a two-electrode stru...

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Abstract

The invention relates to a packaging process of a white light light-emitting diode (LED). The packaging process comprises the steps of providing a packaging support, a light-transmitting seal cover and a blue LED flip chip; performing crystal fixing, and fixing the blue LED flip chip on the packaging support; performing wire bonding, and enabling an anode and a cathode of the blue LED flip chip to be electrically connected with a first electrode and a second electrode on the packaging support respectively; dispensing gel, and filling the well made fluorescence gel in the packaging support; performing sealing, and assembling the light-transmitting seal cover at the top of the packaging support; performing centrifugal precipitation, enabling fluorescent powder in the fluorescence gel to be deposited on the surface of the bottom of the packaging support and the surface of the LED chip under the effect of centrifugal force, and forming a high-concentration fluorescent powder layer; performing baking, and enabling the LED undergoing centrifugal precipitation to be placed in a baking device to perform baking. By means of the uniform high-concentration fluorescent powder layer deposited on the surface of the blue LED flip chip, light spots can be greatly improved, and brightness of an LED lamp is improved.

Description

【Technical field】 [0001] The invention relates to an LED encapsulation process, in particular to a white LED encapsulation process. 【Background technique】 [0002] As LEDs, as a new generation of light sources, are increasingly used in people's work and life, their applications are becoming more and more extensive. Among them, there are a large number of auxiliary lighting for electric tools, especially portable flashlights, bulb lamps, fluorescent tubes, etc. For example, portable flashlights need to narrow the angle of light due to the focus of light. The angle of ordinary LEDs is about 90 degrees, and the yellow spring is very obvious. CREE launched the X series high-power, which is used in portable flashlights. The light spot and brightness are very good. Due to technology monopoly, domestic portable flashlight bulbs can only optimize the light spot through the manufacturing process (by adding diffuser powder or using fine phosphor powder), but due to the existing manuf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/54
CPCH01L2224/8592H01L2224/48091H01L2924/00014
Inventor 彭胜钦
Owner BONSHINE OPTICAL ELECTRON TECH
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