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Anisotropic conductive film and semiconductor device

An anisotropic, conductive film technology, used in semiconductor devices, electrical solid-state devices, semiconductor/solid-state device manufacturing, etc., can solve problems such as low reliability, slow low-temperature curing performance, etc.

Inactive Publication Date: 2013-06-26
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition to this significance, there are still problems of slow low temperature curing performance and lower reliability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0102] Preparation of anisotropic conductive film containing fluorene-substituted phenoxy resin and fluorene-substituted acrylate

[0103] Based on 100 parts by weight of the solid content of the anisotropic conductive film to be prepared,

[0104] 1) 47 parts by weight of fluorene-substituted phenoxy resin (FX293, New Japan Chemical),

[0105] 2) 35 parts by weight of fluorene-substituted acrylate (BPF-022, Hannong Chemicals Inc.),

[0106] 3) 5 parts by weight conductive particles (NIEYB00375, Sekisui),

[0107] 4) 3 parts by weight of bonding aid (KBM-403, Shinetsu), and

[0108] 5) 10 parts by weight of capsule-type imidazole curing agent (HXA-3941, Asahi Kasei) is used to prepare the anisotropic conductive film composition.

[0109] The composition was stirred at room temperature (25°C) at such a rate that the conductive particles were not broken. The resulting solution was thinly coated on the surface of a polyethylene terephthalate (PET) base film treated with a s...

example 2

[0111] Preparation of anisotropic conductive films containing fluorene-substituted phenoxy resins, fluorene-substituted acrylates, and epoxy resins

[0112] The preparation method of this anisotropic conductive film is the same as the method of Example 1, except that the consumption of fluorene-substituted phenoxy resin is 32 parts by weight, the consumption of fluorene-substituted acrylate is 25 parts by weight, and epoxy resin (SG-80H , Nagase) in an amount of 25 parts by weight.

example 3

[0114] Preparation of Anisotropic Conductive Films Containing Fluorene-Substituted Phenoxy Resins, Fluorene-Substituted Acrylates, Epoxy Resins, and Urethane Acrylates

[0115] Based on 100 parts by weight of the solid content of the anisotropic conductive film to be prepared,

[0116] 1) 20 parts by weight of fluorene-substituted phenoxy resins,

[0117] 2) 10 parts by weight of fluorene-substituted acrylate,

[0118] 3) 20 parts by weight epoxy resin (SG-80H, Nagase),

[0119] 4) 10 parts by weight polyurethane acrylate

[0120] 5) 12 parts by weight of radically polymerizable resin (80MFA, Kyoeisha Chemical Co., Ltd.),

[0121] 6) 5 parts by weight of conductive particles (NIEYB00375, Sekisui),

[0122] 7) 3 parts by weight of bonding aid (KBM403, Shinetsu), and

[0123] 8) 10 parts by weight of a peroxide initiator (BPO / LPO, Dongsung Highchem) was used to prepare the anisotropic conductive film composition.

[0124] The above composition was used in the same prepar...

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PUM

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Abstract

The present invention discloses an anisotropic conductive film and a semiconductor device. The film uses a fluorenyl substituted product of an anionic curable compound and substantially a fluorene substituted product of a radical curable compound that can be mixed with the anionic curable compound, thereby achieving the miscibility of the fluorenyl substituted product. More specifically, the anisotropic conductive film comprises a fluorene substituted phenoxy resin and a fluorene substituted acrylic ester that can be mixed with the fluorene substituted phenoxy resin, displays a rapid curing property and a high energy storage modulus at a low temperature, and realizes a high reliability.

Description

technical field [0001] The present invention relates to an anisotropic conductive film using a fluorene-substituted product of an anionically curable compound and a fluorene-substituted product of a radically curable compound to obtain miscibility of an anionically curable compound and a radically curable compound. [0002] More specifically, the present invention relates to an anisotropic conductive film containing fluorene-substituted phenoxy resin and fluorene-substituted acrylate to have miscibility, fast curing performance at low temperature and high storage modulus, thereby realizing high reliability. Background technique [0003] In recent years, connection methods based on the application of anisotropic conductive films for connection between electronic components or semiconductor devices and substrate terminals have been widely used. This anisotropic conductive connection method is widely used in the flat panel manufacturing of flat panel displays for the connectio...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J171/12C09J163/10C09J175/14H01L23/488C09J7/10
CPCH01L24/29H01L2224/2929H01L2224/32225H01L2924/07811H01L2224/2939H01L2224/29455H01L2224/29439H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29393H01L2224/29444C09J9/02C09J2433/00H01L2924/15788C09J7/10C09J2463/00C09J2301/314C09J2301/304H01L2924/00014H01L2924/0665H01L2924/00H01B1/12H01B5/14H01L21/02H01L23/4828
Inventor 韩在善金显昱南宫贤熺徐辰瑛郑光珍鱼东善
Owner CHEIL IND INC
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