Electric vehicle controller and vehicle including said electric vehicle controller

Abstract

The invention belongs to the technical fields of controllers and electric vehicles, and relates to an electric vehicle controller and a vehicle comprising the same. According to the electric vehicle controller, surface mounted power devices are arranged on a circuit board; through holes penetrating through the circuit board are formed in surface mounted power device mounting positions; a plurality of heat conduction columns in a base are extended into the through holes of the circuit board respectively, and are in insulated contact with the bottom planes of the surface mounted power devices; power input and three-phase output conductive columns welded on the circuit board are extended from through holes in an upper cover in a sealing and insulating way to form connecting blocks of the controller; a plurality of limiting columns on the upper cover are elastically pressed against the upper surfaces of the surface mounted power devices, and fix the circuit board on the base; and a signal wire on the circuit board is electrically connected with an electric connector extended from a box body. The vehicle comprises the electric vehicle controller. The electric vehicle controller and the vehicle comprising the same have the advantages of high heat conductivity, small size, high power, applicability to a full-automatic surface mounting production process, low failure rate and long service life.

Description

technical field [0001] The invention belongs to the technical field of a controller and a vehicle including the controller, in particular to an electric vehicle controller and a vehicle including the electric vehicle controller. Background technique [0002] At present, the connection structure between the SMD power component and the circuit board on the vehicle controller has the following structures: One of the more common ones is that the bottom heat dissipation surface of the SMD power component is closely attached to the aluminum substrate or copper substrate of the metal substrate superior. The disadvantage is that the aluminum substrate or copper substrate of the metal substrate is more expensive than the general circuit board, and the aluminum substrate or copper substrate of the metal substrate can only place SMD components on one side. The other is to directly weld the SMD power element to the front of the heat-conducting copper block embedded in the circuit board...

AI Technical Summary

Problems solved by technology

The disadvantage is that the aluminum substrate or copper substrate of the metal substrate is more expensive than the general circuit board, and the aluminum substrate or copper substrate of the metal substrate can only place SMD components on one side

The other is to directly weld the SMD power element to the front of the heat-conducting copper block embedded in the circuit board, and then connect the heat-conducting copper block to the heat dissipation plate to facilitate heat dissipation (see "SMD High-Power SMD" disclosed in Chinese patent CN101556941B Component Heat Dissipation Structure" literature), its shortcomings: First, due to the high power of some SMD power components, larger heat-conducting copper blocks and heat dissipation plates must be used, resulting in larger circuit boards and affecting the performance of electrical appliances. The overall layout; the second is that due to the high power of some SMD power components, the heat dissipation part of the SMD power component and the heat dissipation aluminum plate or copper plate are prone to local overheating after welding, resulting in desoldering, which can easily lead to circuit failure

[0003] In addition, the power lines, three-phase output lines and signal lines on the existing vehicle controller are directly welded on the circuit board, and then lead out in bundles from the lead-out holes of the casing, and a sealant is provided at the lead-out holes for sealing. The disadvantages are: first, it is difficult to disassemble and assemble, and it is difficult to maintain; second, it is easy to pull the wire directly on the soldering point on the circuit board to cause open circuit or even short circuit fault; third, bundled power lines, three-phase Output lines and signal lines are not easy to identify and connect, and installation errors are prone to occur

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