Through silicon via manufacturing method
A technology of through-silicon vias and semiconductors, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as short-circuit or open-circuit connections, affecting the yield of semiconductor devices, and achieve the effect of improving the yield.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0034] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples.
[0035] It can be seen from the background technology that after the TSV is manufactured according to the trap technology to form the conductive connection, the formed conductive connection protrudes from the plane, for example, the reason for protruding the metal interconnection layer and the back surface of the substrate is that the conductive connection is polished to the plane. Afterwards, an annealing step is performed. During the high-temperature annealing process, the materials of the conductive wiring and the metal interconnection layer are different. However, the annealing step is to release the polishing pressure and cannot be canceled, so in order not to cancel the annealing step, but also to overcome the fact that the conductive wiring formed ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com