X-ray detector optical path rotation mechanism

Abstract

The present invention discloses an X-ray detector optical path rotation mechanism, which comprises a bracket, wherein the upper end of the bracket is provided with a bearing pedestal assembly, a short shaft is arranged inside the bearing pedestal assembly, one end of the short shaft is fixedly connected with the middle portion of a rotation arm, both ends of the rotation arm are respectively provided with an X-ray detector and an X-ray source, the lower side of the rotation arm is provided with a lever, one end of the bracket is provided with a drive motor, the drive motor is connected with a lead screw, the lead screw is provided with a lead screw sleeve, and the lead screw sleeve is rotatably connected with the lower end of the lever through a connection rod. The X-ray detector optical path rotation mechanism has characteristics of rational design, simple structure, multi-angle detection, simple manufacturing, low production cost, and easy promotion and use.

Description

Technical field [0001] The invention relates to an X-ray detection system, in particular to an optical path rotation mechanism of an X-ray detector which can perform front and side detection of components on a PCB board. Background technique [0002] At present, the quality inspection of PCB boards with high-density pin ICs and concealed pin ICs is mainly done by automated testing instruments, but most of them use intensifying screens or medical X-ray enhancement technology to obtain images, due to the existence of the above equipment The shortcomings of low resolution, large volume and high cost can no longer meet the inspection requirements, and it is difficult to achieve multi-angle and detailed inspection, so that it is impossible to make a comprehensive and detailed inspection of the welding situation of a hidden device, and it is also impossible to detect PCB The slight deformation of the board cannot guarantee the quality of the soldered PCB board. [0003] Foreign countrie...

AI Technical Summary

Problems solved by technology

[0002] At present, the quality inspection of PCB boards with high-density pin ICs and hidden pin ICs is mainly done by automated testing instruments, but most of them use intensifying screens or medical X-ray enhancement technology to obtain images. Due to the existence of the above equipment Disadvantages such as low resolution, large size and high cost can no longer meet the inspection requirements, and it is also difficult to achieve multi-angle and detailed inspections, so that it is impossible to make a comprehensive and detailed inspection of the soldering of a hidden device, and it is also impossible to inspect PCBs. The slight deformation of the board cannot guarantee the quality of the soldered PCB board

[0003] Foreign countries have applied high-resolution X-ray technology to the detection of PCB boards, but this high-resolution X-ray technology has problems such as technical complexity and high cost, and cannot be popularized and used in my country.

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