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Heat-conducting silica gel sheet and manufacturing method thereof

A technology of thermally conductive silica gel sheet and thermally conductive powder, which is used in heat exchange materials, chemical instruments and methods, adhesives, etc., can solve problems such as dead corners, uneven processing, poor product quality, etc. The effect of accurate installation and high maintenance efficiency

Active Publication Date: 2013-05-22
东莞市博恩复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process has uneven treatment, which makes the viscosity of the thermally conductive silica gel sheet different in different positions, and even has dead angles, resulting in defects such as poor product quality.
At the same time, due to the two processes of coating and curing, the production efficiency of thermally conductive silicone sheets is very low

Method used

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  • Heat-conducting silica gel sheet and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Get 50 parts by weight of 1000mPas vinyl-terminated polysiloxane into the reactor, then add 1.2 parts by weight of methyl hydrogen polysiloxane, 3 parts by weight of vinyltrimethoxysilane, 150 parts by weight of Particle diameter is the alumina of 30 microns, and the particle diameter of 100 parts by weight is the alumina of 3.5 microns, the platinum catalyst of 0.3 parts by weight, the butynol inhibitor of 0.005 parts by weight, and above-mentioned material is vacuum stirred by high-speed power mixer for 30 minutes , to obtain a homogeneous mixture of materials. Fill the mixed material after stirring into a frame-shaped mold with a thickness of 2mm. The frame-shaped mold is an open-top mold, which is convenient for the upper surface of the material to be solidified and formed. After the material loaded into the frame mold is leveled, the excess material is scraped out with a scraper. Put the mold with the mixed material into the oven, and cure it at 100°C for 15 minut...

Embodiment 2

[0025] Take 50 parts by weight of 500mPas vinyl-terminated polysiloxane and add it to the reactor, then add 2 parts by weight of methyl hydrogen polysiloxane, 3 parts by weight of γ-methacryloxypropyl trimethyl Oxygen silane, the particle diameter of 120 parts by weight is the aluminum powder of 15 microns, the particle diameter of 80 parts by weight is the aluminum powder of 4 microns, the platinum catalyst of 0.3 parts by weight, the butynol inhibitor of 0.005 parts by weight, above-mentioned material is made of A high-speed power mixer vacuum stirred for 40 minutes to obtain a uniformly mixed mixture. Fill the mixed material after stirring and mixing into a frame mold with a thickness of 2 mm. After the material loaded into the frame mold is leveled, use a scraper to scrape off the excess material, then put the rubber material and the mold together in the oven, and cure at 120°C for 10 minutes. Silicone sheet.

Embodiment 3

[0029] Get 50 parts by weight of 1000mPas vinyl-terminated polysiloxane into the reactor, then add 1.2 parts by weight of methyl hydrogen polysiloxane, 3 parts by weight of vinyltrimethoxysilane, 300 parts by weight of Particle diameter is the aluminum oxide powder of 45 microns, and the particle diameter of 200 parts by weight is the alumina of 5 microns, the platinum catalyst of 0.6 parts by weight, the butynol inhibitor of 0.007 parts by weight, and above-mentioned material is vacuum stirred by high-speed power mixer 50 Minutes to obtain a homogeneous mixture. Fill the mixed material after stirring and mixing into a frame mold with a thickness of 2 mm. After the material loaded into the frame mold is leveled, use a scraper to scrape off the excess material, then put the rubber material and the mold together in the oven, and cure at 150°C for 5 minutes. Silicone sheet.

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Abstract

The invention discloses a heat-conducting silica gel sheet and a manufacturing method thereof. The heat-conducting silica gel sheet is a sheet shaped body which is formed by mixing and mould-pressing the following components in parts by weight: 10-50 parts of polysiloxane, 20-600 parts of heat-conducting powder, 0.1-5 parts of surface modifier, 0.2-2 parts of cross-linking agent, 0.01-1 part of platinum catalyst and 0.0001-0.01 part of inhibitor. The manufacturing method of the heat-conducting silica gel sheet comprises the following steps: a adding polysiloxane, heat-conducting powder, the surface modifier, the cross-linking agent, the platinum catalyst and the inhibitor to a reaction kettle in proportion in sequence, and stirring the components for 30-50 minutes to obtain mixed materials; b filling the mixed materials to a frame-shaped mould and flatting the upper surface of the frame-shaped mould; and c putting the mould with the mixed materials to an oven, curing for 5-20 minutes at 80-150 DEG C, and forming to obtain the heat-conducting silica gel sheet with a predetermined thickness, wherein one surface of the heat-conducting silica gel sheet has viscosity and the other surface of the heat-conducting sheet does not have viscosity. According to the heat-conducting silica gel sheet and the manufacturing method thereof disclosed by the invention, the single-surface viscosity characteristic of the heat-conducting silica gel sheet is achieved without a secondary process, and the process treatment uniformity is ensured by the one-step forming process.

Description

【Technical field】 [0001] The invention relates to a heat-conducting interface material, in particular to a heat-conducting silica gel sheet which can be used as a gap filling material between a heating element and a heat-dissipating element and has a single-side viscosity after one-time molding and a preparation method thereof. 【Background technique】 [0002] In daily life, people will widely use all kinds of electronic products, ranging from TV sets to MP3 players, and all electronic products involve heat dissipation, because the temperature of electronic components in electronic products will increase during use. Increase, especially transistors and some semiconductor components are particularly prone to heat. When the temperature of electronic components is high, the performance of electronic components will be reduced, so it is necessary to dissipate heat from electronic components. For this reason, usually larger electronic products are equipped with fans for heat dissi...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/04C09J7/00C09K5/14
Inventor 彭建军陶藤王勇
Owner 东莞市博恩复合材料有限公司
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