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PTFE (polytetrafluoroethylene) base material with high filler content and preparation and application thereof

A high filler and content technology, applied in chemical instruments and methods, circuit substrate materials, layered products, etc., can solve the problems of complex process, large waste water, high water absorption rate of plates, etc., achieve excellent comprehensive performance, solve complex process, The effect of water absorption reduction

Active Publication Date: 2013-05-15
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method will generate a large amount of waste water, the process is complicated, and the manufacturing cost is high; and after the lubricant is baked away, there will be many cavities inside the base material, resulting in a high water absorption rate of the board.

Method used

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  • PTFE (polytetrafluoroethylene) base material with high filler content and preparation and application thereof
  • PTFE (polytetrafluoroethylene) base material with high filler content and preparation and application thereof
  • PTFE (polytetrafluoroethylene) base material with high filler content and preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] PTFE resin powder with a particle size of about 38 μm, produced by Daikin Corporation of Japan.

[0081] Composition ratio of fluororesin dispersion emulsion: 100g of PTFE emulsion, 10g of PFA emulsion, 10g of FEP emulsion, appropriate amount of deionized water, and adjust the solid content to 50%. The emulsions are all produced by Daikin Corporation of Japan.

[0082] Inorganic filler: microsilica powder, particle size about 2~10μm, Donghai Microsilica Powder Factory.

[0083] Lubricant, DPG, commercially available.

[0084] Take 1000g of the above PTFE resin powder, add 1000g of silicon micropowder, stir and mix in a high-speed mixer for about 1 hour, then add 300g of lubricant DPG, mix at a slow speed for 20 minutes, send the mixture to the extruder, and extrude it into a diameter of about 5mm rods, the rods are then rolled several times to finally obtain a sheet with a size of 300×300×1.0mm, and the sheet is heat-treated at 300°C / 120 minutes, and after cooling, im...

Embodiment 2

[0088] PTFE resin powder, particle size about 50μm.

[0089] Composition ratio of fluororesin dispersion emulsion: 100g of PTFE emulsion, 10g of PFA emulsion, 10g of FEP emulsion, appropriate amount of deionized water, and adjust the solid content to 50%. The emulsions are all produced by Daikin Corporation of Japan.

[0090] Inorganic filler: titanium dioxide, particle size about 20μm.

[0091] Lubricant, DOP, commercially available.

[0092] Take 800g of the above PTFE powder, add 1200g of titanium dioxide, stir and mix in a high-speed mixer for about 0.5 hours, then add 300g of lubricant DOG, mix at a slow speed for 20 minutes, send the mixture to the extruder, and extrude it into a diameter of about 5mm. Rod, the rod is then rolled several times to finally obtain a sheet with a size of 300×300×1.0mm. The sheet is heat-treated at 350°C / 60 minutes. After cooling, immerse in the above-mentioned fluororesin fractional emulsion for 2 minutes , take it out and put it into an ...

Embodiment 3

[0094] PTFE resin powder with a particle size of about 15 μm, produced by Daikin Corporation of Japan.

[0095] Composition ratio of fluororesin dispersion emulsion: PTFE emulsion 100g, appropriate amount of deionized water, adjust the solid content to 50%. The emulsion was produced by Daikin Corporation of Japan.

[0096] Inorganic filler: silicon dioxide, particle size about 10 μm, Donghai Silica Powder Factory.

[0097] Lubricant, PIB, commercially available.

[0098] Take 800g of the above PTFE powder, add 1200g of silicon micropowder, stir and mix in a high-speed mixer for about 1.5 hours, then add 300g of lubricant PIB, mix at a slow speed for 20 minutes, send the mixture to the extruder, and extrude it into a diameter of about 5mm The rod is then rolled several times to finally obtain a sheet with a size of 300×300×1.0 mm. The sheet is heat-treated at 250°C / 360 minutes. After cooling, it is immersed in the above-mentioned fluororesin fractional emulsion 7 minutes, ta...

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Abstract

The invention provides a preparation method of a PTFE (polytetrafluoroethylene) copper-clad plate with high filler content, which comprises the following steps of: mixing fluororesin powder and inorganic filler, adding a lubricating agent and stirring to obtain a dough-shaped object; performing the extrusion, calendering and the like to obtain a sheet; performing heat treatment on the sheet; stepping the sheet in fluororesin dispersing emulsion; and drying, baking and sintering to obtain a sheet with few pores and covered with a layer of resin film on the surface, wherein a copper-clad plate made from the sheet has good comprehensive performance.

Description

technical field [0001] The invention relates to a PTFE base material, a preparation method and its use, in particular, the invention relates to a high-filler content PTFE base material, a preparation method and its use. Background technique [0002] Information electronic products are gradually developing in the direction of high frequency and high speed. Traditional substrate materials will be gradually replaced by high-speed, high-reliability substrate materials. In recent years, scientific and technological workers have conducted in-depth research on the selection and performance of high-frequency and high-speed substrate materials, aiming to find substrate materials with excellent dielectric properties, mechanical properties and thermal properties to meet the requirements of actual use. [0003] Since the commercial production of polytetrafluoroethylene (PTFE) by DuPont in 1945, due to the unique physical and chemical properties of the material, people have continuously...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K13/06C08K3/22C08K3/36C08K3/34C08K3/24C08K3/30C08K3/26B32B15/082B32B15/20H05K1/03
Inventor 江恩伟
Owner GUANGDONG SHENGYI SCI TECH
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