Preparation method, grinding method and device for microsection sample

Abstract

The invention discloses a preparation method for a microsection sample. The method comprises the following steps: providing a glue-pouring mould, wherein the glue-pouring mould comprises a step-shaped cavity, and the cavity consists a top part, a middle part and a bottom part, of which the diameters are sequentially reduced; providing a sample to be detected, wherein the sample to be detected comprises at least one circuit board slice connected in series through a positioning member, and a plurality of metalized holes in at least one circuit board slice are located in the same horizontal plane; placing the sample to be detected in the cavity of the glue-pouring mould through the positioning member and between the middle part and the bottom part of the cavity, and ensuring that a dividing line of the middle part and the bottom part is coincided with the center of the metalized holes; and pouring and filling pre-blended colloid into the cavity of the glue-pouring mould, and taking out the colloid after being completely cured to obtain the step-shaped microsection sample. The invention further discloses a grinding method and a device for a microsection.

Description

technical field [0001] The invention relates to the field of printed circuit board production, in particular to a method for preparing a metallographic section sample, a grinding method and a device. Background technique [0002] Printed circuit board lamination and hole metallization are two key processes of circuit boards and the key to realizing reliable interconnection between circuit board layers. The quality of lamination and electroplating copper plating is closely related to the performance of the circuit board. Lamination conditions such as delamination and lamination voids exceeding the standard, and coating conditions such as plating voids and hole wall defects exceeding the standard may cause serious performance problems. cause the circuit board to fail. There are strict testing requirements in industry standards, and some products and customers also require testing reports and even testing samples. [0003] In order to evaluate the quality of the lamination sy...

AI Technical Summary

Problems solved by technology

[0007] Various aspects of the embodiments of the present invention propose a method for preparing metallographic slice samples, a grinding method for metallographic slices, and a grinding device, which can replace manual operations, realize automatic grinding of metallographic slice samples, and solve the problem of automatic grinding in the prior art The machine cannot control the grinding position and depth of defects, and it can be ground to the center of the metallized hole of the sample to be tested in one step

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