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Wandering star wheel

A technology of star wheel and sub-wheel, which is applied in the field of grinding vehicles after sapphire slicing, can solve the problems of high cost, easy broken pieces, and many defects, and achieve the effects of reducing grinding costs, uniform grinding operations, and ingenious and reasonable design

Inactive Publication Date: 2013-03-20
江苏吉星新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the traditional carrier is used to grind various non-standard parts, it causes high cost, many defects after grinding, and is easy to break

Method used

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Embodiment Construction

[0009] The present invention will be further described below in conjunction with the accompanying drawings.

[0010] As shown in the figure, a planetary wheel of the present invention is suitable for grinding non-standard pieces of sapphire. The planetary wheel includes two parts, the main wheel 1 and the child wheel 2. The main wheel 1 rotates with the grinding equipment, and drives the sub-wheel 2 to rotate and revolve during the rotation. Preferably, the master wheel 1 is made of blue steel with good wear resistance, and the sub-wheel 2 is made of relatively cheap plastic fiber because there are many types of workpieces. During the grinding operation, first put the main wheel 1 into the grinding equipment as required, then put the sub-wheel 2 into the main wheel 1, and finally put the LED workpiece 3 to be processed into the sub-wheel 2. During the grinding process, the workpiece 3 will rotate and revolve correspondingly with the rotation and revolution of the sub-wheel 2...

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Abstract

The invention discloses a wandering star wheel, belonging to the technical field of sapphire processing. The wandering star wheel consists of a main wheel and sub-wheels, wherein teeth matched with grinding equipment are arranged on the outer circumference of the main wheel; holes matched with the external diameters of the sub-wheels are formed in the main wheel; and other holes for the accommodation of workpieces to be processed are formed in the sub-wheels. In comparison with the prior art, during the grinding of the wandering star wheel, the sub-wheels rotate in the main wheel, so that the processed workpieces are driven to self-rotate; in such a way, the grinding is more uniform; after the grinding, the indexes such as TTV (Total Thickness Variation) and Warp for the surfaces of wafers can reach requirements; the wandering star wheel is skillful and rational in design; and in addition, the problem of manufacturing multiple diecarriers during the grinding ofn various nonstandard pieces is solved, and the grinding cost is decreased greatly.

Description

technical field [0001] The invention belongs to the technical field of sapphire processing, in particular to a carrier for grinding sapphire after slicing. Background technique [0002] Sapphire is an important material for processing blue light diodes and plays a pivotal role in the semiconductor field. Before making the sapphire slices required by customers, the sapphire should be sliced ​​and ground. In the prior art, after sapphire is sliced, a double-side grinding process is often used for processing. During processing, the sapphire slices are ground by abrasive powder particles. The grinding of sapphire lining is a very important process in the manufacture of sapphire substrate, which determines the total thickness variation, warpage, surface roughness and other related qualities of the wafer after sapphire slicing. When the traditional carrier is used to grind various non-standard parts, the cost is high, and there are many defects after grinding, and it is easy to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/27
Inventor 戴磊王禄宝
Owner 江苏吉星新材料有限公司
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