A kind of packaging adhesive modified by nano diatomite

Abstract

The invention discloses a nano-kieselguhr modified adhesive for packaging. The adhesive is prepared from the following raw materials in parts by weight: 100-120 parts of styrene, 100-150 parts of ethyl acetate, 20-25 parts of duprene rubber CR121, 15-20 parts of xylene, 1-2 parts of 4,4'-diphenyl methane diisocyanate, 8-12 parts of polyisobutylene, 2-3 parts of 3-aminopropyltriethoxysilane, 2-3 parts of polytetramethylene ether glycol, 3-5 parts of SG-2 PVC (polyvinyl chloride) resin, 1-2 parts of ferrocene, 10-15 parts of epoxide resin modified polyamide hot-melt adhesive, and the like. The adhesive is excellent in heat resistance and cold resistance, high in cohesive strength, water-resistant, moisture-proof, good in storage stability, good in environment friendliness, good in using effect and convenient.

Description

technical field [0001] The invention relates to an adhesive, in particular to a nano diatomite modified adhesive for packaging. Background technique [0002] Packaging adhesives are produced and developed on the basis of the rapid development of the packaging industry. The performance and quality of packaging adhesives directly affect the packaging effect and quality. At present, packaging adhesives generally have poor heat resistance. Poor, poor cold resistance, poor storage stability. In order to overcome the shortcomings of traditional adhesives such as poor heat resistance, poor cold resistance, and poor storage stability, a new type of packaging adhesive is produced by improving the formula. Contents of the invention [0003] The purpose of the present invention is to provide a packaging adhesive modified by nano diatomite with good heat insulation, good water resistance, high bonding strength and good storage stability. [0004] The technical scheme that the presen...

AI Technical Summary

Problems solved by technology

[0002] Packaging adhesives are produced and developed on the basis of the rapid development of the packaging industry. The performance and quality of packaging adhesives directly affect the packaging effect and quality. At present, packaging adhesives generally have low heat resistance. Poor, poor cold resistance, poor storage stability

In order to overcome the shortcomings of traditional adhesives such as poor heat resistance, poor cold resistance, and poor storage stability, a new type of packaging adhesive is produced by improving the formula.