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Curable composition and method for producing cured film

A curable composition and compound technology, which is applied in semiconductor/solid-state device manufacturing, electric solid-state device, coating, etc., can solve the problem that fluorine-containing polyarylene resin cannot be used, and achieve the effect of preventing warping

Inactive Publication Date: 2014-12-24
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is considered that fluorine-containing polyarylene resin cannot be used in a low-temperature process using a substrate with a low heat-resistant temperature.

Method used

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  • Curable composition and method for producing cured film
  • Curable composition and method for producing cured film
  • Curable composition and method for producing cured film

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0357] (Synthesis Example 1: Synthesis of Fluorinated Polyarylene Ether Prepolymer (A1))

[0358] PFB (450 g), pentafluorophenylacetylene (155 g) and 1,3,5-tri Hydroxybenzene (130g) was reacted at 60°C for 45 hours to synthesize a prepolymer (A1). The DMAc solution of the obtained prepolymer (A1) was placed in an aqueous hydrochloric acid solution (3.5% by mass aqueous solution), reprecipitated and purified, and vacuum-dried to obtain 620 g of a powdery prepolymer (A1). The number average molecular weight (Mn) of the prepolymer (A1) was 10,000.

Synthetic example 2

[0359] (Synthesis Example 2: Synthesis of Fluorinated Polyarylene Ether Prepolymer (A2))

[0360] In DMAc (492g) solvent, in the presence of pentafluorostyrene (22g), 1,1,1-tris(4-hydroxyphenyl)ethane (33g) and sodium carbonate (51g), at 60°C After making it react for 24 hours, the solution which melt|dissolved PFB (40g) in DMAc (360g) was added next, and it was made to react at 60 degreeC for 17 hours, and the prepolymer (A2) was synthesize|combined. The obtained DMAc solution of the prepolymer (A2) was placed in an aqueous hydrochloric acid solution (3.5% by mass aqueous solution), reprecipitated and purified, and vacuum-dried to obtain 750 g of a powdery prepolymer (A2). The number average molecular weight (Mn) of the prepolymer (A2) was 10,000.

Synthetic example 3

[0361] (Synthesis Example 3: Synthesis of Fluorinated Polyarylene Ether Prepolymer (A3))

[0362] In DMAc (6.2 kg) solvent, in the presence of PFB (650 g), 1,3,5-trihydroxybenzene (120 g) and potassium carbonate (570 g), after reacting at 40° C. for 6 hours, then, 4-Acetoxystyrene (200g) was made to react in presence of 48 mass % potassium hydroxide aqueous solution (530g), and the prepolymer (A3) was synthesize|combined. The obtained DMAc solution of the prepolymer (A3) was placed in an aqueous hydrochloric acid solution (3.5% by mass aqueous solution), reprecipitated and purified, and vacuum-dried to obtain 800 g of a powdery prepolymer (A3). The number average molecular weight (Mn) of the prepolymer (A3) was 10,000.

[0363]

[0364] The abbreviations indicate the following compounds.

[0365] [Monomers having a fluoroalkyl group (Cf)]

[0366] C6FMA:CH 2 =C(CH 3 ) COOCH 2 CH 2 (CF 2 ) 6 F.

[0367] C4FMA:CH 2 =C(CH 3 ) COOCH 2 CH 2 (CF 2 ) 4 F.

[0368] ...

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Abstract

To provide a curable composition which is sufficiently cured even without a heating step at high temperature and from which a low dielectric constant cured film excellent in the solvent resistance is obtained. A curable composition comprising a fluorinated polyarylene prepolymer (A) having a crosslinkable functional group, a compound (B) having a number average molecular weight of from 140 to 5,000, having at least two crosslinkable functional groups and having no fluorine atoms, a copolymer (C) having the following units (c1) and (c2) and a radical polymerization initiator (D): unit (c1): a unit having a fluoroalkyl group having at most 20 carbon atoms, which may have an etheric oxygen atom between carbon atoms, and having no crosslinkable functional group; unit (c2): a unit having a crosslinkable functional group.

Description

technical field [0001] The present invention relates to a curable composition and a method for producing a cured film using the curable composition. Background technique [0002] The development of insulating materials with low dielectric constants is being advanced in the field of electronics. For example, polyarylene resins have been proposed as insulating materials suitable for interlayer insulating films of semiconductor elements, gate insulating films of thin film transistors (TFTs), stress relaxation layers of rewiring layers, and the like (Patent Document 1). [0003] In addition, a negative photosensitive resin composition having photosensitivity has also been proposed among arylene resins (Patent Document 2). If it has photosensitivity, it can be subjected to microfabrication by photolithography, for example, like a photoresist. If the interlayer insulating film is formed using, for example, a photosensitive polyarylene resin, there is an advantage that contact ho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F299/02H01L21/336H01L29/786H01L51/05H01L51/30
CPCC08F216/1408C08L27/12C09D4/06C08L65/00C08L35/02C09D171/00C08L49/00C08G65/007C08L29/10C08L33/16H01L21/02104C08F299/02H01L51/052C08F290/06C08F222/18C08F220/30C08F220/302H10K10/471C08F220/22C08F220/06C08F220/20C08F212/20C08F212/22C08L71/12H01L29/786H10K10/00
Inventor 伊藤昌宏阿部岳文鹤冈薰江里口武
Owner ASAHI GLASS CO LTD
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