Exposure system, calibration system, optical engines, exposure method, and production method

Abstract

The invention discloses an exposure system, a calibration system, optical engines, an exposure method, and a production method. The exposure system comprises a first optical engine, a second optical engine; an optical source system, which can be used to provide exposure light beams to the first optical engine and the second optical engine; a first beam splitting device, which is disposed on a first side, and can be used to split the light beams emitted by the first optical engine and the second optical engine; a first visual system, which is disposed on the first side, and can be used to receive the first light beam going through the first optical engine and reflected by the first light splitting device, and can be used to receive the second light beam going through the second light optical engine and reflected by the first light splitting device; and an optical axis, which can be used to calibrate the first optical engine, and the second optical engine. The exposure system, the calibration system, the optical engine, the exposure method, and the production method provided in the utility model can be used to calibrate the optical axis of each of the optical engines, therefore the exposure quality can be improved.

Description

technical field [0001] The invention relates to maskless direct writing digital lithography technology, in particular to a double-sided maskless exposure system, a calibration system for a double-sided maskless exposure system, an optical engine for maskless exposure, a double-sided Maskless exposure method and device manufacturing method. Background technique [0002] At present, the printed circuit board PCB exposure industry mainly uses film mask technology, but this technology has obvious disadvantages, such as easy deformation of the film, low alignment accuracy, only a line width of about 4 mils, and difficulties in film storage and management Wait. With the development of PCB towards high-density interconnect HDI and multi-layer, PCB circuit boards require smaller line width and higher alignment accuracy. However, the traditional film mask (MASK) exposure lithography process has been unable to meet the production technology bottleneck caused by the continuous improv...

AI Technical Summary

Problems solved by technology

Even though maskless optical systems are already aligned at the time of manufacture, they are easily affected by changes in vibration, temperature and other environmental conditions

[0006] Therefore, in actual production and application, it is impossible to align or inspect the optical axes of the maskless optical engines in the double-sided maskless exposure system, resulting in that the alignment accuracy between the maskless optical engines cannot be guaranteed , thus seriously affecting the exposure quality of the exposure system

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