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Thick-ceramic-base printed circuit board processing method

A technology for printed circuit boards and processing methods, applied in the directions of printed circuits, printed circuit manufacturing, manufacturing tools, etc., can solve the problems of easy breakage of panels, easy cracking of holes, etc.

Active Publication Date: 2015-04-15
CHENGDU AEROSPACE COMM EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for processing thick ceramic-based printed circuit boards, which can solve the problems of easy cracking of holes and easy breakage of panels when CNC drilling machines and milling machines are used to drill holes and shape milling of thick ceramic-based printed circuit boards. technical problem

Method used

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with specific embodiments.

[0018] A method for processing a thick ceramic-based printed circuit board includes a drilling step and a shape milling step for the thick ceramic-based printed circuit board. The drilling step has process parameters: the tool diameter is 0.5-6mm, and the rotation speed is 20-40 thousand revolutions / min, the tool feed rate is 0.1-0.8 m / min, and the tool retraction speed is 5-8 m / min; the profile milling step adopts a double-edged milling cutter, and its process parameters are: tool diameter 1 -3mm, the rotation speed is 18-30 thousand revolutions / min, the cutting speed is 0.4-0.6 m / min, and the falling speed is 0.5-0.7 m / min.

[0019] Further, the process parameters of the drilling step are: the tool diameter is less than or equal to 1.15mm, the rotation speed is 22-25 thousand revolutions / min, the feed rate is 0.6-0.7 m / min, and the tool retraction speed is 6-8 m / min. minute. ...

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Abstract

The invention discloses a thick-ceramic-base printed circuit board processing method, which comprises a drilling step and a shape milling step for a thick-ceramic-base printed circuit board. In the drilling step, the technological parameters are as follows: the cutter diameter is 0.5-6mm, the revolving speed is 20,000-40,000 rpm, the amount of feed is 0.1-0.8 meter per minute, and the cutter withdrawing speed is 5-8 meter per minute. A dual-edge milling cutter is adopted in the shape milling step, the technological parameters of the shape milling step are as follows: the cutter diameter is 1-3mm, the revolving speed is 18,000-30,000 rpm, the cutter feeding speed is 0.4-0.6 meter per minute, and the cutter withdrawing speed is 0.5-0.7 meter per minute. The thick-ceramic-base printed circuit board processing method has the beneficial effects that when drilling and shape milling are carried out on the thick-ceramic-base printed circuit board by a digital-controlled drill and a milling machine, the drilling parameters and the milling parameters of the thick-ceramic-base printed circuit board processing method are adopted to prevent holes and boards from cracking.

Description

Technical field [0001] The invention relates to a method for processing a circuit board, in particular to a method for processing a ceramic-based printed circuit board with a thickness greater than 3 mm. Background technique [0002] Ceramic substrates are mainly used for high-reliability strip line and microstrip line designs. The dielectric constant is very wide. Because the material has low thermal expansion coefficient, good thermal conductivity, high hardness, good flatness, good electromagnetic compatibility, etc. Advantages: At present, ceramic-based printed boards are widely used in the aviation and aerospace fields, but the material itself has high hardness and high brittleness, which makes its mechanical processing performance poor. Traditional mechanical processing can easily cause plate collapse, especially for thick plates. The processing is more difficult, which brings great difficulty to the processing of the entire thick ceramic base printed circuit board. The ge...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00B23B35/00B23C3/00
Inventor 杨朝志马忠义刘厚文
Owner CHENGDU AEROSPACE COMM EQUIP CO LTD
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