Polyamide and polyamide composition

A technology of polyamide and hexamethylenediamine, applied in the field of polyamide and polyamide composition, can solve the problems of producing polyamide resin, producing fluidity change, unable to stabilize the molded body, etc. Excellent impact properties

Active Publication Date: 2013-02-13
ASAHI KASEI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] On the other hand, when molding is carried out under high temperature conditions, there may be a problem that the polyamide resin is decomposed or the fluidity changes, so that a molded product cannot be stably obtained.

Method used

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  • Polyamide and polyamide composition
  • Polyamide and polyamide composition
  • Polyamide and polyamide composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0206] Dissolve 1237 g of an equimolar salt of adipic acid and hexamethylenediamine, 263 g of an equimolar salt of isophthalic acid and hexamethylenediamine, and adipic acid in an excess of 0.5 mol % relative to the total equimolar salt components In 1500 g of distilled water, an equimolar 50% by mass homogeneous aqueous solution of the raw material monomer was prepared.

[0207] This aqueous solution was charged into an autoclave with an internal volume of 5.4 L, and replaced with nitrogen.

[0208] Stir the aqueous solution at a temperature of 110-150° C., and at the same time slowly extract water vapor to concentrate to a solution concentration of 70% by mass.

[0209] Then, the inner temperature of the autoclave was raised to 220°C.

[0210] At this time, the pressure of the autoclave was increased to 1.8 MPa.

[0211] Heating was performed under this pressure for 1 hour until the internal temperature of the autoclave reached 245° C., and the reaction was carried out for...

Embodiment 2

[0219] 1132 g of equimolar salts of adipic acid and hexamethylenediamine and 368 g of equimolar salts of isophthalic acid and hexamethylenediamine were used.

[0220] Other conditions were the same as in Example 1, and a polyamide was obtained by the same method as in Example 1.

[0221] Polymer properties such as the isophthalic acid component ratio (x), isophthalic acid end group ratio (EG), and formic acid solution viscosity of the obtained polyamide were measured by the methods described above. The measurement results are shown in Table 1 below.

[0222] In addition, using the obtained polyamide, a molded article was produced by the method described above, and evaluations of appearance stability and impact properties were performed. The evaluation results are shown in Table 1 below.

Embodiment 3

[0224] 1044 g of equimolar salts of adipic acid and hexamethylenediamine and 456 g of equimolar salts of isophthalic acid and hexamethylenediamine were used.

[0225] Other conditions were the same as in Example 1, and a polyamide was obtained by the same method as in Example 1.

[0226] Polymer properties such as the isophthalic acid component ratio (x), isophthalic acid end group ratio (EG), and formic acid solution viscosity of the obtained polyamide were measured by the methods described above. The measurement results are shown in Table 1 below.

[0227] In addition, using the obtained polyamide, a molded article was produced by the method described above, and evaluations of appearance stability and impact properties were performed. The evaluation results are shown in Table 1 below.

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Abstract

Provided are a polyamide and a polyamide composition which, even when molded under severe molding conditions, attain satisfactory stability with respect to the surface appearance of the molded objects and which have excellent impact resistance. The polyamide (A) comprises units (a) formed from adipic acid and hexamethylenediamine and units (b) formed from isophthalic acid and hexamethylenediamine, wherein the proportion (x) of isophthalic acid units to all carboxylic acid units in the polyamide is 0.05=(x)=0.5 and the block ratio (Y) is -0.3=(Y)=0.8. The polyamide composition comprises 30-95 mass% the polyamide and 5-70 mass% inorganic filler (B).

Description

technical field [0001] The present invention relates to polyamides and polyamide compositions. Background technique [0002] Polyamide resins have been widely used as materials for various parts such as clothing, industrial materials, automobiles, electrical and electronic products, and industrial applications due to their excellent moldability, mechanical properties, and chemical resistance. [0003] In recent years, moldings using polyamide resins are sometimes molded under high-cycle molding conditions in which the molding temperature is raised and the mold temperature is lowered in order to increase productivity. [0004] In addition, polyamide resins are widely used in the automotive field. However, in such applications, the current situation is that the use environment tends to be harsh thermally and mechanically. Both impact resistance and surface appearance are satisfied. [0005] On the other hand, when molding is performed under high temperature conditions, there...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/26C08K3/00C08L77/06
CPCC08K3/0033C08K7/14C08G69/265C08L77/06C08K3/013C08G69/26C08K3/00
Inventor 佐佐木幸义小山田洋鹿野泰和
Owner ASAHI KASEI KK
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