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Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure

An electronic component and anisotropic technology, applied in the field of anisotropic conductive film, can solve the problems of difficult reel loading and unloading times and increased costs

Inactive Publication Date: 2013-01-30
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the adhesive tape proposed in Patent Document 1, it is difficult to greatly reduce the number of reel attachment and detachment, and it is necessary to manufacture adhesive tapes of various widths, which increases the cost.

Method used

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  • Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure
  • Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure
  • Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure

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Embodiment 2~ Embodiment 20）

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Abstract

The present invention provides an anisotropic conductive film with which production efficiency can be improved. The present invention is configured in such a manner that: a conductive particle-containing layer (3), which is obtained by dispersing at least conductive particles in a binder, is formed on a substrate (2); slit lines (4), which have an angle b with respect to the longitudinal direction (L) of the substrate (2) and divide the conductive particle-containing layer (3), are formed on at least the conductive particle-containing layer (3); and the angle b satisfies 180 degrees > b > 0 degrees (excluding 90 degrees).

Description

technical field [0001] The present invention relates to an anisotropic conductive film and a method for producing an anisotropic conductive film used when electrically connecting electronic components (for example, connecting a liquid crystal display panel, etc., to a flexible printed wiring board, semiconductor element, etc.), And a connection method and a connection structure between electronic components using the anisotropic conductive film. [0002] This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2010-250143 for which it applied in Japan on November 8, 2010, and takes in this application by referring this application. Background technique [0003] An anisotropic conductive film is generally used as a connection method for connecting a liquid crystal display panel, a PDP (plasma display panel), an EL (fluorescent display) panel, etc. to a circuit board or connecting circuit boards to each other, and fixing and ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01C09J7/00C09J9/02C09J133/08C09J163/00H01B5/16H01B13/00H01R43/00C09J7/10
CPCC09J133/08H01R13/2414C09D5/24C09D163/00C09J9/02C09J2203/318C09J7/10
Inventor 小西美佐夫
Owner DEXERIALS CORP
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