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Processing technology for Y cover for detecting circuit board

A processing technology and circuit board technology, which is applied in the field of mechanical processing, can solve problems such as low efficiency, improved efficacy, and disadvantages, and achieve the effects of increasing production capacity, reducing labor costs, and improving processing efficiency

Active Publication Date: 2013-01-30
SUZHOU ERIC MECHANICS & ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the boring process needs to process concentric circular holes. The common processing method is to use two clamping methods. During the clamping process, the processing requirements are met by ensuring the accuracy of the reference plane or ensuring the consistency of the clamping. This processing method is efficient relatively low
At the same time, the general processing technology is to process the hole once in place, that is, to complete the hole opening and tapping in one step, but this will repeat the surface milling process, which is not conducive to improving the efficiency

Method used

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  • Processing technology for Y cover for detecting circuit board
  • Processing technology for Y cover for detecting circuit board
  • Processing technology for Y cover for detecting circuit board

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Embodiment Construction

[0013] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0014] see Figure 1 to Figure 4 , the embodiment of the present invention includes: a Y cover processing technology for circuit board detection, first, blanking: determine the material size according to the requirements of the drawing; second, rough milling: rough milling the general shape and surface size of the part; third, boring Hole: Use concentric boring tooling to bore Φ68 central through hole 1 on the upper surface and Φ36 central through hole 2 on the lower surface, and bore Φ18 flash through hole; fourth, fine milling: finish milling all dimensions of the part; fifth, spot drilling: Drill Φ4.2 deep holes carefully; sixth, tapping: Φ18 ...

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Abstract

The invention discloses a processing technology for a Y cover for detecting a circuit board. The processing technology comprises steps as follows: 1 feeding: determining the dimensions of materials according to the requirements of a drawing; 2. roughly milling: roughly milling parts to obtain the general shape and the dimension of the surface; 3. boring holes: boring central through holes being Phi 68 in the upper surface and central through holes being Phi 36 in the lower surface through a concentric boring tool, and boring flash through holes being Phi 18; 4. finely milling: finely milling all the parts based on the dimension; 5. conducting spot drilling: forming deep holes being Phi 4.2 carefully in a spot drilling manner; 6. conducting tapping: conducting tapping on the through holes Phi 18 until reaching (M20*1.5), and conducting tapping on the deep holes being Phi 4.2 until reaching (M5*10); 7. conducting surface treatment: removing burr, and adding yellow chromate (MIL-C-5541); and 8. packaging and warehousing: individually packaging each part through a bubble pack, and then warehousing. Through the processing technology for the Y cover for detecting the circuit board, the Y cover for detecting the circuit board can be quickly, simply and conveniently processed, so that the processing efficiency can be improved while the quality of products is ensured, the labor cost is decreased, the capacity is increased, and massive production can be achieved.

Description

technical field [0001] The invention relates to a mechanical processing method, in particular to a Y cover processing technology for circuit board inspection. Background technique [0002] The processing process of the Y cover for circuit board inspection includes: material preparation, milling shape, boring, tapping and surface treatment. Among them, the boring process needs to process concentric circular holes. The common processing method is to use two clamping methods. During the clamping process, the processing requirements are met by ensuring the accuracy of the reference plane or ensuring the consistency of the clamping. This processing method is efficient relatively low. At the same time, the general processing technology is to process the hole once in place, that is, to complete the hole opening and tapping in one step, but this will repeat the surface milling process, which is not conducive to improving the efficiency. Contents of the invention [0003] The tec...

Claims

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Application Information

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IPC IPC(8): B23P15/00
Inventor 高俊邵光勇
Owner SUZHOU ERIC MECHANICS & ELECTRONICS CO LTD
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