Bimetal composite plate and its manufacturing process
A technology for composite panels and manufacturing processes, applied to bimetal composite panels, the manufacturing process for manufacturing the above-mentioned bimetal composite panels, and the field of panel manufacturing technology, can solve the problems of limiting the popularization and application of bimetal composite panels, reducing the bonding surface of polymer films, Unable to guarantee the bond strength and other issues, to achieve the effect of excellent creep resistance, stable overall performance, and strong bond
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no. 1 example
[0043] Include the following steps:
[0044] a. Apply polyurethane adhesive evenly between the surface metal and the bottom metal;
[0045] b. Superimposed surface metal and underlying metal;
[0046] c. Protective film on the opposite metal layer;
[0047]d. The surface layer metal and the bottom metal are rolled together at room temperature;
[0048] e. Cut board;
[0049] f. Curing at low temperature in the range of 35°C-55°C.
no. 2 example
[0051] a. Apply polyurethane adhesive evenly between the surface metal and the bottom metal;
[0052] b. Superimposed surface metal and underlying metal;
[0053] c. Protective film on the opposite metal layer;
[0054] d. Divide 8 heating temperature zones on the upper and lower sides of the composite board, and each two are paralleled as a group of synchronous control, and the group is gradually heated to 80°C for heating and rolling compounding;
[0055] e. Cut board;
[0056] f. Curing at low temperature in the range of 35°C-55°C.
no. 3 example
[0058] a. Apply polyurethane adhesive evenly between the surface metal and the bottom metal;
[0059] b. Superimposed surface metal and underlying metal;
[0060] c. Protective film on the opposite metal layer;
[0061] d. Divide 8 heating temperature zones on the upper and lower sides of the composite board, and each two are paralleled as a group of synchronous control, and the grouping is gradually heated to 100 °C for heating and rolling compounding;
[0062] e. Cut board;
[0063] f. Curing at low temperature in the range of 35°C-55°C.
[0064] The polyurethane adhesive base material described in the above steps is mainly modified polyphenylene oxide (MPPO), supplemented by polystyrene (PS).
[0065] In the process flow, the adhesive is cast and coated on the bimetal composite interface, and under heating and rolling at room temperature or lower than 100°C, sufficient initial bonding force can be produced within 150 seconds to meet the needs of the production process an...
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