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Thermal wave dynamic image sequence fitting reconstruction method

A dynamic image and sequence technology, applied in image data processing, 2D image generation, instruments, etc., can solve problems such as reduced compression efficiency, and achieve the effects of high compression efficiency, reduced storage space, and high fitting accuracy

Inactive Publication Date: 2013-01-09
PLA SECOND ARTILLERY ENGINEERING UNIVERSITY
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Problems solved by technology

[0004] However, during the experiment, it was found that since the TSR technology uses polynomials for fitting, in order to improve the fitting accuracy, the fitting coefficient must be increased, which reduces the compression efficiency

Method used

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  • Thermal wave dynamic image sequence fitting reconstruction method
  • Thermal wave dynamic image sequence fitting reconstruction method
  • Thermal wave dynamic image sequence fitting reconstruction method

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Embodiment

[0027] Step 1: Design the embedded defect experimental specimen as shown in Appendix 1. The source of the specimen is a metal steel shell. The length of the specimen is 280mm, the width is 200mm, and the thickness is 6mm. There are 8 flat-bottomed holes on the back to simulate the debonding defect. The top four flat-bottomed holes have the same depth of 1mm, and the diameters are 5mm, 10mm, 16mm, and 20mm respectively; the lower four flat-bottomed holes have the same diameter of 20mm, and the depths are 2mm, 3mm, 4mm, and 5mm respectively. The structural dimensions are shown in Appendix 2 . The pulse heating method is used to apply thermal excitation to the test piece, and the temperature field changes on the surface of the test piece are recorded in real time through a thermal imager. A total of 100 frames of infrared thermal images were collected in the experiment. Attachment 3 shows the 20th frame of thermal images after applying pulse thermal excitation.

[0028] Step 2: ...

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Abstract

The invention provides a differential evolution-based double-exponential thermal wave dynamic image sequence fitting reconstruction method. The method comprises the steps: designing an embedded defective test specimen and applying instantaneous thermal excitation to the specimen, and collecting temperature field change condition in real time by a thermal imager; selecting a part of typical pixel points to acquire a temperature-time change sequence and graphing; according to the shape of the sequence and fitting function, selecting a fitting model and fitting; evaluating through fitting evaluation parameter values, fitting all pixel points in an original image by adopting the model, and reconstructing the image according to the fitting coefficient. Compared with the prior art, the method has the beneficial effects that original data can achieve higher precision without pretreatment; the speed is faster, temperature sequence of single pixel point containing 100 data is fitted only for 10-150milliseconds; and under the condition of not influencing the effect, only four fitting coefficients are provided by the method, the image compression efficiency is higher, and the storage space can be further reduced.

Description

technical field [0001] The invention belongs to the technical field of non-destructive testing and image processing, and relates to an infrared thermal image sequence processing method of the infrared thermal wave non-destructive testing technology, in particular to a method for fitting and reconstructing a dynamic image sequence of a double-exponential thermal wave based on differential evolution. Background technique [0002] Infrared thermal wave non-destructive testing technology, as a new non-destructive testing method, has attracted widespread attention at home and abroad in recent years, and is widely used in non-destructive testing fields such as aerospace, electric power, materials, medicine, and construction. However, due to the large amount of image sequence information generated in the detection process, it brings inconvenience to image storage and processing. Whether the image can be fit and reconstructed efficiently and accurately is the basis of post-image pro...

Claims

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Application Information

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IPC IPC(8): G06T11/00
Inventor 张金玉张炜杨正伟田干张勇张智翔金国锋王冬冬
Owner PLA SECOND ARTILLERY ENGINEERING UNIVERSITY
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