Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board

Abstract

The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Description

technical field [0001] The present invention relates to an epoxy resin composition for prepreg which can be used in the manufacture of printed wiring boards including multilayer printed wiring boards, and prepregs using the epoxy resin composition for prepregs. Prepregs, multilayer printed wiring boards using the prepregs, especially epoxy resin combinations for prepregs that are most suitable for the production of printed wiring boards for plastic packaging and printed wiring boards for cards materials, prepregs, and multilayer printed circuit wiring boards. Background technique [0002] So far, the following three conditions have been required for printed wiring board materials for plastic packaging or printed wiring board materials for cards. [0003] First, it has excellent flame retardancy even without adding a halogen-based compound as a flame retardant that may form particularly toxic polybrominated dibenzodioxin, furan, and the like. [0004] Second, it has excelle...

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Problems solved by technology

[0007] However, it has been pointed out that in the above-mentioned method, along with the further high density of printed circuit boards in recent years, for the processing of small-diameter drills with a drill diameter of 0.20 mm or less, the deviation of the hole position during processing is large, and it is difficult to Combines excellent hole position accuracy with excellent heat resistance and thermal rigidity

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