Efficient and low-cost hollow-out method for sapphire wafer bar

Abstract

The invention discloses an efficient and low-cost hollow-out method for a sapphire wafer bar. Problems that an existing method for hollowing out a bar is poor in chip removal effect and large quantities of cooling liquid cannot reach a bar hollowed-out portion are solved. The efficient and low-cost hollow-out method mainly includes steps of (1), fixing a sapphire crystal on a machine tool, and turning on a cooling water pipe to continuously feed cooling liquid into the sapphire crystal; and (2), moving a cutter to a position to be processed and forming the sapphire wafer bar by more than one processing cycle. Each processing cycle includes hollowing out the bar, lifting the cutter, removing chips and moving the cutter downwards. In the step of hollowing out the bar, the rotational speed of the cutter ranges from 300r / min to 500r / min, and the bar begins to be hollowed out; in the step of lifting the cutter, the cutter is quickly lifted up when the depth of a hollowed-out portion of the bar ranges from 2mm to 5mm; in the step of removing the chips, the rotational speed of the cutter is controlled to range from 500r / min to 1000r / min, and the rotational speed of the cutter is adjusted to range from 300r / mm to 500r / min after 3-6 seconds; and in the step of moving the cutter downwards, the cutter moves downwards to the position to be processed. The efficient and low-cost hollow-out method has the advantages of high efficiency, good chip removal effect and cooling effect, and the like.

Description

technical field [0001] The present invention relates to a method for removing a wafer rod, in particular to a method for removing a rod from a sapphire wafer with high efficiency and low cost. Background technique [0002] The sapphire crystal has high hardness and high processing resistance. The large amount of heat generated by the tool grinding the crystal during rod removal will cause harm to the tool, and the adhesion of the generated grinding debris to the tool will also seriously affect the grinding performance of the tool. [0003] In order to cool the tool and remove grinding debris, there are usually two processing methods for removing rods: water through the center of the rod removal tool and no water through the center. [0004] The cooling problem can be better solved by adopting the method of passing water through the center of the cutting tool, but it has the following disadvantages: 1. It needs to use expensive CNC machining center equipment, 2. The tool clam...

AI Technical Summary

Problems solved by technology

[0004] The cooling problem can be better solved by adopting the method of water passage through the center of the cutting tool, but there are the following disadvantages: 1. It needs to use expensive CNC machining center equipment, 2. The tool clamping mechanism is complicated

[0005] Operators who use the method of cutting out the center of the knife without water flow usually use a radial drilling machine to dig out the rod. In this method, the operator manually controls the feeding of the knife, and the following problems will exist in the process of removing the rod: 1. The coolant cannot reach the rod in large quantities. 2. Poor chip removal effect, 3. Low processing efficiency

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