Modified thermoplastic phenolic resin adhesive and production method
A phenolic resin and thermoplastic technology, applied in the field of phenolic resin adhesives, can solve the problems of high production environment of free phenols, affect the adhesive force of adhesives, increase production costs, etc., achieve low content of free phenols and free aldehydes, improve Quality, strong adhesion effect
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Embodiment 1
[0014] Embodiment 1, a modified thermoplastic phenolic resin adhesive, its composition and proportion by weight are: 1 part of phenol, 0.7 part of formaldehyde, 0.0008 part of sulfuric acid, and 0.04 part of methyl glucoside.
[0015] Preparation method: including the following process steps:
[0016] ①. Put the aldehyde and phenol into the reaction kettle according to the proportion of the components, and first add 10% acid, heat to 100 ℃, react for 30 minutes, then gradually add the remaining acid within 45 minutes, and continue the reaction for 30 minutes;
[0017] ②. Then add methyl glucoside to react for 30 minutes, control the temperature at 100°C, turn on the vacuum pump at the same time to control the pressure of the reactor to 0.07Pa, and carry out dehydration for 5 hours to obtain the product.
[0018] The product has been tested: gelation time (s): 70, free phenol content (%): 1.5, volatile matter content (%): 2.4.
Embodiment 2
[0019] Example 2, a modified thermoplastic phenolic resin adhesive, its components and proportions by weight percentage are: 1 part of o-cresol, 0.8 part of paraformaldehyde, 0.0008 part of oxalic acid, and 0.2 part of methyl glucoside.
[0020] Preparation method: including the following process steps:
[0021] ①. Put the aldehyde and phenol into the reaction kettle according to the proportion of the components, and first add 10% acid, heat to 100 ℃, react for 30 minutes, then gradually add the remaining acid within 45 minutes, and continue the reaction for 30 minutes;
[0022] ②. Then add methyl glucoside to react for 30 minutes, control the temperature at 100°C, turn on the vacuum pump at the same time to control the pressure of the reactor to 0.07Pa, and carry out dehydration for 5 hours to obtain the product.
[0023] The product has been tested: gelation time (s): 90, free phenol content (%): 1.8, volatile matter content (%): 2.7.
Embodiment 3
[0024] Embodiment 3, a modified thermoplastic phenolic resin adhesive, its composition and composition ratio by weight percentage are: 0.6 parts of phenol, 0.4 parts of o-cresol, 0.75 parts of formaldehyde, 0.0008 parts of hydrochloric acid, and 0.03 parts of methyl glucoside share.
[0025] Preparation method: including the following process steps:
[0026] ①. Put the aldehyde and phenol into the reaction kettle according to the proportion of the components, and first add 10% acid, heat to 100 ℃, react for 30 minutes, then gradually add the remaining acid within 45 minutes, and continue the reaction for 30 minutes;
[0027] ②. Then add methyl glucoside to react for 30 minutes, control the temperature at 100°C, turn on the vacuum pump at the same time to control the pressure of the reactor to 0.07Pa, and carry out dehydration for 5 hours to obtain the product.
[0028] The product has been tested: gelation time (s): 80, free phenol content (%): 1.6, volatile matter ...
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