Double-layer composite micropunch sound absorption method and sound absorption panel

Abstract

The invention provides a double-layer composite micropunch sound absorption method and a sound absorption panel. The panel in the thickness of 0.5-2mm is adopted to serve as a protective panel, holes are evenly arranged on the panel with the hole diameter of 0.5-1mm, punching rate is 1-10%, a second layer is a punching thin film with the thickness of about 0.1-0.3mm, the hole diameter is 0.1-0.2mm, and the punching rate is about 1-2%. A cavity is arranged between two layers, the thickness of the cavity is within 5cm, the two layers are matched to use to form double resonance effects, and a sound absorption frequency belt of a structure is effectively increased. The double-layer composite micropunch sound absorption method and the sound absorption panel solves the problem that base plate micropunch manufacture is difficult, and strength of thin film micropunch manufacture is insufficient though the thin film micropunch manufacture is simple. Simultaneously, the device is simple, simple and convenient to manufacture, light in thin shape, wide in application face, easy to wash and resisting to high temperature and has excellent weather fastness and environmental protection function.

Description

technical field [0001] The invention belongs to the field of acoustic technology, and specifically relates to a new non-fiber double-layer composite micro-perforated sound absorption method and structure, which can realize a sound absorption structure with excellent medium and low frequency sound absorption performance, weather resistance, environmental protection and light transmission, and belongs to the sound absorption structure. The field of noise reduction and environmental protection technology. Background technique [0002] The micro-perforated resonant sound-absorbing structure has achieved good sound-absorbing effects in many years of practice. It has a strict theory, does not require porous sound-absorbing materials, and can be used in harsh environments such as high temperature, high-speed airflow, humidity, and rot. At the same time, it has simple structure, convenient processing and transportation, reliable and convenient installation, and low cost. In practi...

AI Technical Summary

Problems solved by technology

In practice, in order to ensure the structural strength, the material of the substrate is hard or thick, so it is difficult to process the hole diameter smaller than 0.5mm, thus limiting the width of its sound absorption frequency band

The thin film can achieve ultra-micro perforation processing, but because of its soft material, it cannot be used alone, which greatly limits its application range.

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