Semiconductor epitaxial wafer substrate-bearing disk, supporting device thereof and metal organic chemical vapor deposition (MOCAD) reaction chamber

A technology for reaction chambers and loading trays, applied in the field of support and rotary connection devices, can solve the problem of not being easy to ensure the verticality of the loading tray and the axis of the rotating shaft, affecting the service life of the rotating shaft and the loading tray, and controlling the speed of the loading tray Inaccurate and other issues, it is not easy to slide relative to each other, it is conducive to growth, and the effect of saving materials

Active Publication Date: 2014-08-20
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is still an intermediate support method, and the strength requirements for the loading tray are still relatively high.
[0006] The above two connection forms of the loading tray and the rotating shaft can realize the convenient replacement of the loading tray, but the coupling contact surface between the loading tray and the rotating shaft of the two structures is relatively small, and it is not easy to ensure that the upper surface of the loading tray is in contact with the rotating shaft. The verticality of the shaft axis; and when the speed of the rotating shaft changes greatly, there may be relative slippage between the loading disc and the rotating shaft, which makes the speed control of the loading disc inaccurate, and also affects the rotation axis and the loading. Disc life

Method used

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  • Semiconductor epitaxial wafer substrate-bearing disk, supporting device thereof and metal organic chemical vapor deposition (MOCAD) reaction chamber
  • Semiconductor epitaxial wafer substrate-bearing disk, supporting device thereof and metal organic chemical vapor deposition (MOCAD) reaction chamber
  • Semiconductor epitaxial wafer substrate-bearing disk, supporting device thereof and metal organic chemical vapor deposition (MOCAD) reaction chamber

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0051] In this embodiment, there is no groove 16 on the lower surface of the slide tray 2; Figure 6 As shown, the lower part of the circular outer surface 21 of the loading disk 2 is designed as a conical surface 23; The slide disc 2 is coupled to the hollow rotating shaft 6 via the two conical surfaces 23 , 62 . The positioning of the slide tray 2 is accomplished through the pair of coupled conical surfaces 23, 62, and the rotating shaft 6 drives the slide tray 2 to rotate through the coupling taper surfaces.

[0052] Other structures are similar to Embodiment 1 and will not be repeated here.

Embodiment 3

[0054] In this example, if Figure 7 Shown; There is no groove 16 on the lower surface of the loading disc 2, and the bottom of the circular outer surface 21 of the loading disc 2 is recessed inwardly to form a conical surface structure, but the maximum diameter of the conical surface is larger than the diameter of the circular outer surface It should be small, so that the top of the loading disk 2 forms a flange, and there is an annular surface 22 under the flange; The end face also has a circular surface 64 . The slide disc 2 is coupled to the rotating hollow shaft 6 through a tapered surface. At this time, there is a slight gap between the annular surface 22 below the flange and the annular surface 64 on the top of the hollow shaft 6 . The slide tray 2 is positioned through the coupled conical surface, and the hollow shaft 6 drives the slide tray 2 to rotate through the coupled cone surface.

[0055] The lower part of the circular outer surface of the loading disk 2 is a ...

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Abstract

The invention discloses a semiconductor epitaxial wafer substrate-bearing disk, a supporting device thereof and a metal organic chemical vapor deposition (MOCAD) reaction chamber. A substrate-bearing cavity which is used for bearing a substrate is arranged on the upper surface of the substrate-bearing disk of a semiconductor epitaxial wafer; an annular structure which is coupled with the upper end face of a supporting shaft is arranged at a position of the lower surface of the substrate-bearing disk, which is close to the outer surface of the substrate-bearing disk; the supporting device comprises the supporting shaft which is connected with the substrate-bearing disk in a coupling mode and the supporting shaft is a hollow shaft; the MOCAD reaction chamber comprises an annular reaction chamber wall, the supporting shaft which is located on the inner side of the reaction chamber wall and the substrate-bearing disk which is installed at the top end of the supporting shaft; and a spraying nozzle is arranged on the upper portion of the substrate-bearing disk. The structure of the MOCAD reaction chamber is characterized in that the substrate-bearing disk is the substrate-bearing disk of the semiconductor epitaxial wafer, the supporting shaft is the hollow shaft, a fixing shaft is arranged inside the hollow shaft, and a heater is arranged on the lower portion of the substrate-bearing disk. Accordingly, the substrate-bearing disk has a simple structure, the production process of the substrate-bearing disk is simplified, simultaneously, the thickness of the substrate-bearing disk can be thinner on the premise that the requirement for strength is met, materials are saved and the temperature change rate of the substrate-bearing disk is improved.

Description

technical field [0001] The invention relates to a device for semiconductor epitaxy equipment, in particular to a metal organic chemical vapor deposition (MOCVD) carrier disk and a supporting and rotating connection device matched with it; and a reaction chamber using the device. Background technique [0002] MOCVD equipment, metal organic chemical vapor deposition equipment is the most important equipment for the production of third-generation semiconductor materials GaN (GaAs, AlN, etc.); it is the key equipment in the semiconductor industry. The equipment integrates various disciplines such as computational fluid dynamics, heat transfer, system integration control, and compound growth. It is a high-tech and high-tech equipment; it is a strategic high-tech semiconductor that breaks through the bottleneck of industrial development and improves the industrial level. equipment. [0003] In order to improve production efficiency and equipment utilization when MOCVD deposits se...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/458
Inventor 魏唯罗才旺贾京英陈特超孙雪平吕文利
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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