Micro electro mechanical bearing piece and manufacturing method thereof

Abstract

The invention discloses a micro electro mechanical bearing piece and a manufacturing method thereof. The micro electro mechanical bearing piece comprises a core plate, a bearing layer, a solder mask layer and a shielding metal layer, wherein the core plate comprises a first surface and a second surface opposite to each other; a circuit layer is arranged on the first surface and comprises an electric contact pad and a perforation which penetrates through the first and second surfaces; the bearing layer is arranged on the second surface of the core plate, seals one end of the perforation and a patterned metal layer positioned in the perforation; the solder mask layer is arranged on the first surface and the circuit layer of the core plate; a plurality of openings are formed in the solder mask layer, so that the electric contact pad is exposed out of the openings; and the shielding metal layer is arranged on a wall of the perforation and on the bearing and the patterned metal layer in the perforation. According to the patterned metal layer formed on the bearing layer, a micro electro mechanical component and a chip are arranged on the patterned metal layer and the bearing layer, so that a circuit board is not required to be used, the height of an integral structure is effectively reduced, and the electronic products are thinned.

Description

technical field [0001] The present invention relates to a carrier and its manufacturing method, in particular to a micro-electromechanical carrier and its manufacturing method. Background technique [0002] At present, micro-electro-mechanical devices such as microphones are widely used in mobile communication equipment, audio devices, etc., and in order to protect the micro-electro-mechanical devices, a covering member must be provided on the micro-electro-mechanical devices to prevent the micro-electro-mechanical devices from The device is exposed and damaged. [0003] see Figure 1A to Figure 1E , which is a schematic cross-sectional view of a conventional manufacturing method in which the covering member 1 is covered on the MEMS device. [0004] Such as Figure 1A As shown, firstly, a core board 10 having at least one through hole 100 is provided, and an adhesive layer 12 is formed on a surface of the core board 10 . [0005] Such as Figure 1B As shown, a carrier la...

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Problems solved by technology

[0009] However, the existing cover member 1 only has the shielding metal layer 15, and does not have other functional metal layers, so it can only be used to cover the micro-electro-mechanical components 31 and the ASIC chip 32, so that the Both the MEMS components 31 and ASIC chips 32 need to be placed on the circuit board 11 and then covered by the cover member 1, resulting in an increase in the height of the overall structure, which is not conducive to the thinning of electronic products

[0010] In addition, since the MEMS assembly 31 needs to be arranged on the circuit board 11, a space S is formed between the sound hole 130 of the cover member 1 and the MEMS assembly 31, so that the path for the MEMS assembly 31 to receive signals is relatively short. Long, thus reducing the stability and transmission speed of the signal

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