Flexible circuit board, chip on film and manufacturing method

Abstract

The invention discloses a flexible circuit board, a chip on film and a manufacturing method. The flexible circuit board for hot pressing comprises an insulating substrate with a strip edge; multiple pins for hot pressing are arranged on the insulating substrate; the flexible circuit board is characterized in that the pins for hot pressing are arranged along the strip edge of the insulating substrate from the two ends to the middle; and the space between adjacent two pins is gradually reduced. In the invention, after heat bonding, the spaces among the pins can be basically kept consistent, being equivalent to the expansion result of a liquid crystal panel, and thus sound electrical connection between the pins and the lead of the liquid crystal panel is guaranteed, and the electrical contact is more reliable.

Description

technical field [0001] The invention relates to the field of liquid crystal display, and more specifically relates to a flexible circuit board, a chip-on-chip film and a manufacturing method. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board), also known as "soft board", is a printed circuit made of a flexible insulating substrate, which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of flexible circuit boards can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widel...

AI Technical Summary

Problems solved by technology

[0005] The problem of the prior art is: the expansion coefficient of the colloidal material between the leads on flexible circuit boards such as chip-on-chip films is large, and the huge heat of the pressure head during thermal bonding will cause the leads to no longer be equally spaced. For chip-on-chip films , the expansion of the corresponding liquid crystal panel is small, which makes it difficult for the pins of the chip-on-film and the leads of the liquid crystal panel to overlap completely, making the signal transmission abnormal

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