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MEMS (micro-electro-mechanical system) acoustic sensor based on graphene

An acoustic sensor and graphene technology, applied in the field of micro-sensors, can solve the problems of insufficient sensitivity and self-noise, and achieve the effects of high sensitivity, strong flexibility, and good structural consistency

Active Publication Date: 2014-05-21
ZHONGBEI UNIV
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  • Abstract
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Problems solved by technology

The frequency response of various common silicon microcapacitor microphones is generally between 100Hz-10kHz, which can meet the frequency response requirements of the microphone, but it is not enough in terms of sensitivity and self-noise

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  • MEMS (micro-electro-mechanical system) acoustic sensor based on graphene
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  • MEMS (micro-electro-mechanical system) acoustic sensor based on graphene

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Embodiment Construction

[0022] The present invention will be further explained below in conjunction with the drawings:

[0023] figure 1 It is a three-dimensional view of the overall structure. The upper metal layer 3 is made on the bottom surface of the upper structure layer 1, and the lower metal layer 4 is made on the surface of the lower structure layer 2. The upper structure layer 1 passes through the bonds of the upper metal layer 3 and the lower metal layer 4. The joint is firmly connected to the lower structure layer 2.

[0024] figure 2 It is a plan view of the overall structure. The upper structure layer 1 has sound collecting cavities 5 and 6, and the bottom of the sound collecting cavities 5 and 6 are provided with through-hole plates 7, 8, and the through-hole plates 7, 8 are evenly distributed with sound pickup holes 11 , 12.

[0025] The sound collecting cavities 5 and 6 are in an inverted quadrangular pyramid structure and are made by a silicon wet process. The volume of the sound collecti...

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Abstract

An MEMS (micro-electro-mechanical system) acoustic sensor based on graphene mainly structurally comprises an upper structure, an understructure and graphene. Sound collecting cavities, gap cavities, through hole plates, pickup holes, upper metal layers, upper insulating layers, upper metal connecting positions and an upper bonding metal layer are produced on an upper structure layer; through hole plates, gas cavities, damping holes, damping cavities, under metal layers, under insulating layers, under metal connecting positions, a graphene connecting position, an under metal bonding layer, upper metal pads, under metal pads, upper metal connecting holes, under connecting holes and a graphene connecting hole are produced on an understructure layer; and a graphene layer is clamped between the upper insulating layers and the under insulating layers. Graphene materials with thickness of a single carbon atom layer have remarkable mechanical characteristics and electrical characteristics, so that sensitivity and resolution of the acoustic sensor with graphene serving as a vibrating diaphragm are higher and acoustic detection data of the acoustic sensor are detailed, accurate and reliable.

Description

Technical field [0001] The invention relates to a graphene-based MEMS acoustic sensor, which belongs to the technical field of microsensors. Background technique [0002] Traditional silicon micro-capacitor microphones have a dual-chip structure. First, a vibrating diaphragm and a back plate are separately prepared on different silicon wafers, and then assembled or packaged into a capacitor microphone structure. The frequency response of various common silicon micro-capacitor microphones can generally meet the frequency response requirements of the microphone between 100Hz-10kHz, but it is insufficient in terms of sensitivity and self-noise. Graphene is currently the thinnest but hardest nanomaterial in the world. It is almost completely transparent and only absorbs 2.3% of light. The thermal conductivity is as high as 5300W / m·K, which is higher than that of carbon nanotubes and diamonds. Mobility rate exceeds 15000cm 2 / V·s, which is higher than carbon nanotubes or silicon crys...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R19/01
Inventor 李孟委王莉杜康刘俊李锡广白晓晓王增跃王琪
Owner ZHONGBEI UNIV
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