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Resin composition

A resin composition, resin technology, applied in the direction of layered products, metal layered products, printed circuit parts, etc.

Active Publication Date: 2012-08-15
ELITE MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the existing material compositions in the prior art cannot fully meet the needs of the industry, it is necessary to propose a material that can improve the dielectric constant

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0032] A 20% vinyl-toluene solution was prepared by dissolving 40 g of Ricon 250 in 160 g of toluene. Add 100g biphenyl epoxy resin, 46g SMA resin, 15g benzoxazine, 90g aluminum hydroxide, 10g talc, 4g dicumyl peroxide, 1g dicyandiamide (DICY), 8g diamino diphenyl sulfone (DDS), 30g OP 935, 1g TSH, 0.2g 2E4MI, and then add 200g vinyl-toluene solution into the aforementioned reaction flask to prepare Completely dispersed epoxy resin main agent.

Embodiment 2

[0034] A 20% vinyl-toluene solution was prepared by dissolving 40 g of Ricon 250 in 160 g of toluene. Add 100g biphenyl epoxy resin, 26g SMA resin, 30g benzoxazine, 90g aluminum hydroxide, 10g talcum powder, 4g diisophenylpropyl peroxide, 0.5gDICY, 8g DDS, 25g OP 935, 1.5g TSH, 0.2g 2E4MI, and then add 200g vinyl-toluene solution into the aforementioned reaction bottle to prepare the dispersed epoxy resin main agent.

Embodiment 3

[0047] A 20% vinyl-toluene solution was prepared by dissolving 40 g of Ricon 250 in 160 g of toluene. Add 100g of biphenyl epoxy resin, 20g of V-1100X resin, 15g of benzoxazine, 16g of SMA resin, 90g of aluminum hydroxide, 10g of talc, and 4g of diisophenylpropyl peroxide into a 1000mL reaction bottle , 1g DICY, 8g DDS, 40g OP 935, 1g TSH, 0.2g 2E4MI, and then add 200g vinyl-toluene solution into the aforementioned reaction bottle to prepare the dispersed epoxy resin main agent.

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Abstract

The invention relates to a resin composition, mainly comprising the following components in parts by weight: (1) 100 parts of epoxy resin; (2) 20-100 parts of vinyl compound; (3) 10-50 parts of styrene maleic anhydride; (4) 5-50 parts of benzoxazine; (5) 0.5-5 parts of adherence promoter; (6) 10-150 parts of inorganic filler; (7) 0.2-25 parts of peroxide; (8) 10-250 parts of phosphorus-containing fire retardant; and (9) 0.01-10 parts of catalyst.

Description

technical field [0001] The invention relates to a composition, in particular to a resin composition suitable for printed circuit boards. Background technique [0002] Due to the popularity of cloud computing and the increasing application of high-speed transmission, the dielectric constant of the existing FR-4 substrates has gradually been unable to meet the existing needs. Generally speaking, materials with low dielectric constant are mainly used for high-frequency transmission printed circuit boards, insulation protection of electronic components, or laminated insulating films for lead frames. Since the aforementioned applications all involve the high temperature process of printed circuit boards, polyphenylene ether with low dielectric properties is often used for the low dielectric base layer. In addition, because epoxy resin has excellent electrical properties, mechanical strength and chemical resistance properties, and has a good bonding effect on copper foil, polyphe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08L51/08C08L25/08C08K13/02C08K3/22C08K3/34C08K5/14C08K5/31B32B15/092H05K1/02
Inventor 谢镇宇
Owner ELITE MATERIAL
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