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Lead-free low-temperature glass for manufacturing diode glass shell

A low-temperature glass and diode technology, applied in the field of lead-free low-temperature glass, can solve the problems of cracking and acid corrosion resistance that cannot meet the requirements for use, and achieve the effect of improving acid corrosion resistance and maintaining appearance.

Inactive Publication Date: 2012-08-15
金招娣
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the acid corrosion resistance of the glass still cannot meet the actual use requirements, and even the "cracking" phenomenon caused by the acid corrosion on the glass surface during the electroplating process is more serious

Method used

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  • Lead-free low-temperature glass for manufacturing diode glass shell
  • Lead-free low-temperature glass for manufacturing diode glass shell

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Embodiment Construction

[0022] The technical solution of the present invention is specifically described below through examples, and the content of the present invention is not subject to any restriction by the following examples.

[0023] The present invention melts glass samples by means of a laboratory high-temperature electric furnace, and the raw materials used are all high-purity ore raw materials or chemically pure reagents, such as the introduction of SiO 2 of high-purity quartz sand, the introduction of B 2 o 3 of boric acid, the introduction of P 2 o 5 Ammonium dihydrogen phosphate, the introduction of carbonates of alkali metal oxides and alkaline earth metal oxides, the introduction of Al 2 o 3 aluminum hydroxide, introducing TiO 2 Titanium oxide, zinc oxide introduced into ZnO, etc., and with the help of a small amount of Sb 2 o 3 And the joint action of nitrate to realize the clarification of glass liquid. The batch materials of each component were put into a platinum crucible a...

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Abstract

The invention discloses lead-free low-temperature glass for manufacturing a diode glass shell. The glass mainly contains the following components in percentage by mass: 40 to 60 percent of SiO2, 10 to 25 percent of B2O3, 1 to 10 percent of P2O5, 10 to 25 percent of Li2O, Na2O and K2O, 1 to 10 percent of MgO, CaO, SrO and BaO, 0.5 to 10 percent of Al2O3, 0.5 to 5 percent of TiO2, 1 to 10 percent of ZnO, 0 to 5 percent of F2, and 0 to 2 percent of clarifying agent, wherein the clarifying agent can be one or more of Sb2O3, CeO2 and / or As2O3. The lead-free low-temperature glass has very excellent acid corrosion resistance, and meets the requirement of a diode planting process for acid resistance of the glass shell. In addition, the expansion coefficient of the lead-free glass is matched with that of a Dumet wire, the softening temperature does not exceed 630 DEG C, and the glass can be stably sealed with the Dumet wire at the temperature of below 700 DEG C.

Description

(1) Technical field [0001] The invention relates to a lead-free low-temperature glass used for manufacturing diode glass bulbs, specifically a kind of glass that does not contain PbO in its composition, has excellent acid corrosion resistance, meets the requirements of the diode electroplating process, and has an expansion coefficient of 80-100×10 -7 Between / K, it can match and seal with Dumet silk, and the low temperature glass whose softening temperature does not exceed 630°C. (2) Background technology [0002] Small diodes, such as silicon diodes, light-emitting diodes, and thermistors, are usually packaged in a tube, that is, the diode core is sandwiched in a pair of electrodes, and the outer lead Dumet and the glass tube are softened by heating and sealed. Together, an airtight structure is formed. Diode glass bulb materials suitable for this purpose should meet the following performance requirements: ①The expansion coefficient of glass is close to that of Dumet silk,...

Claims

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Application Information

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IPC IPC(8): C03C3/097
Inventor 金招娣张兵
Owner 金招娣
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