Silicon wafer cutting equipment with function of automatic tension adjustment

Abstract

The invention relates to silicon wafer cutting equipment, in particular to silicon wafer cutting equipment with a function of automatic tension adjustment, which belongs to the technical field of cutting machinery. The silicon wafer cutting equipment comprises a wire unwinding roll, a wire winding roll and guide rolls, wherein steel wires are arranged on the wire unwinding roll; the steel wires unwound by the wire unwinding roll are wound on the guide rolls and then wound by the wire winding roll; the wire unwinding roll is connected with a wire unwinding driving mechanism through a wire unwinding transmission mechanism; the wire winding roll is connected with a wire winding driving mechanism through a wire winding transmission mechanism; the silicon wafer cutting equipment with the function of automatic tension adjustment further comprises a microprocessor system; the control end of the wire unwinding driving mechanism and the control end of the wire winding driving mechanism are connected with the microprocessor system respectively; and a tension detecting mechanism is arranged between the wire unwinding roll and the guide rolls. Due to adoption of the technical scheme, the silicon wafer cutting equipment with the function of automatic tension adjustment can automatically adjust the tensions in the wire unwinding and wire winding processes; and the tension adjustment is precise and timely.

Description

technical field [0001] The invention relates to the technical field of cutting machinery, in particular to a silicon wafer cutting device. Background technique [0002] Wire cutting technology is a new type of silicon wafer processing technology, which has the advantages of high efficiency and high precision. The principle is that the high-speed moving steel wire drives the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors, so as to achieve the purpose of cutting. [0003] During the cutting process of the workpiece by wire cutting technology, the steel wire is released through the uncoiling roller and forms a wire mesh on the guide roller. Due to the difference in the diameter of the steel wire winding, the uncoiling roller is prone to tension instability when the wire is unwound. To ensure the processing quality of cutting workpieces, constant tension control is the guarantee of stable, reliable and high-speed equip...

AI Technical Summary

Problems solved by technology

In the process of processing, the tension is unstable, which will cause the steel wire to vibrate during processing, and the wire bow is too large. It is easy to cause irregular and uneven line marks on the cutting surface of the workpiece, and the phenomenon of excessive size deviation will eventually become a waste product.

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