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Grinding apparatus

A technology of grinding and grinding surfaces, which is applied in the direction of grinding devices, grinding machine tools, electrical components, etc., and can solve the problems that the embedding height is not necessarily fixed, and parts cannot be exposed.

Active Publication Date: 2012-08-01
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, according to the above-mentioned grinding device, for example, when the resin is ground to expose the Cu pillars embedded in the resin, etc., when a predetermined part is exposed, the embedding height of the part is not necessarily fixed. Therefore, even if the workpiece is ground Shaved to a constant thickness, sometimes it is not possible to properly expose the part

Method used

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Embodiment Construction

[0020] Next, the configuration and operation of a grinding device according to an embodiment of the present invention will be described with reference to the drawings. In addition, this invention is not limited to this embodiment.

[0021] The structure of the grinding device

[0022] First, refer to Figure 1~3 The structure of the grinding machine which concerns on one Embodiment of this invention is demonstrated. figure 1 It is a perspective view showing the structure of a grinding device according to one embodiment of the present invention, figure 2 It is a side view which shows the structure of the grinding apparatus which concerns on one Embodiment of this invention. image 3 It is a schematic diagram which shows the structure of the detection part of the grinding apparatus which concerns on one Embodiment of this invention.

[0023] Such as figure 1 As shown, a grinding device 1 according to one embodiment of the present invention has a cuboid base 2 . An operati...

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Abstract

Provided is a grinding apparatus, comprising a maintaining member having a maintaining surface, a processing member used for grinding a member kept by the maintaining member, and a control member used for controlling the motion of the processing member, with the member being formed by a first member having its reflectivity as the first reflectivity and a second member having its reflectivity as the second reflectivity, wherein the control member has a detecting portion used for irradiating detecting light over the to-be-grinded surface of the member receiving grinding treatment, receiving the reflected light from the to-be-grinded surface, and stopping the grinding over the member when the light-receiving amount detected by the detecting portion is determined to be exposed by the first member covered by the second member.

Description

technical field [0001] The present invention relates to a grinding device for grinding workpieces such as semiconductor wafers. Background technique [0002] In the manufacturing process of a semiconductor device, in order to obtain a desired thickness of a semiconductor device, at the stage of a workpiece which is an aggregate of a plurality of semiconductor devices, the back surface thereof is ground and polished to reduce the thickness. In addition, with the remarkable thinning of today's semiconductor devices, workpieces are processed thinner. [0003] Usually, grinding or lapping of the workpiece is performed while measuring the thickness. The applicant of the present application proposed a grinding device that accurately measures the thickness of a workpiece while bringing a measuring probe into contact with a surface to be processed, and grinds the workpiece to a desired thickness. (refer to patent document 1) [0004] Patent Document 1: Japanese Patent Laid-Open N...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/013B24B37/04H01L21/304
Inventor 吉田真司
Owner DISCO CORP
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