Method for breaking brittle material substrate

Abstract

Provided is a breaking method by which an end surface strength can be stronger. A method for breaking a brittle material substrate comprises a step for forming a scribe line on the brittle material substrate, and a breaking step for breaking along the scribe line. In the breaking step, a break roller is pressed on and applies a load to the brittle material substrate placed on a table by rolling the break roller near the scribe line along a position separate from the scribe line to one side, so as to fold at a low load and divide the substrate.

Description

technical field [0001] The present invention relates to a fracture method for singulation along a scribe line formed on a brittle material substrate. Here, the brittle material substrate includes glass, ceramics (low-temperature fired ceramics and high-temperature fired ceramics), semiconductor materials such as silicon, sapphire, and the like. In addition, the form of the substrate to be divided includes not only a single board but also a bonded substrate in which two substrates are bonded together. Background technique [0002] Figure 8 It is a diagram showing an example of a conventional method of dividing a glass substrate on which a functional film such as a panel product has been formed using a breaking bar. First, the substrate G is placed on the scribing table of the scribing device, and the scribing line S is formed along the planned division line of the first surface using the cutter wheel W ( Figure 8 (a)). Next, the substrate G is placed on the elastic scribi...

AI Technical Summary

Problems solved by technology

When splitting with a breaking bar, since one scribe line S is split at one time with a large load, the load on the substrate becomes larger, and the split surface tends to be cracked, making it difficult to enhance the strength of the end face.

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