Thinned image capture module and manufacturing method thereof

Abstract

The invention relates to a thinned image capture module and a manufacturing method of the thinned image capture module. The structure comprises a printed circuit board which is provided with a plurality of electronic components; a light-sensing component is packaged on the printed circuit board; a lens is arranged on the light-sensing component to capture an image. The manufacturing method comprises the steps of manufacturing the printed circuit board, tapping a hole on the printed circuit board, adhering a metal film, packaging the light-sensing component and packaging an electronic surface. The manufacturing method specifically comprises the following steps of: manufacturing the printed circuit board and then tapping the hole; adhering the metal film at the back side to cover the hole; packaging the light-sensing component; and packaging the plurality of electronic components on the electronic surface. The overall thickness of the whole image capture module is reduced so as to meet the thickness demand of a thin type notebook computer shell, and the light-sensing component can be stably combined to the printed circuit board so as to prevent from breaking a gold wire in electrical connection due to displacement of the light-sensing component.

Description

technical field [0001] The invention relates to an image capture module, in particular to a thinned image capture module and a manufacturing method thereof. Background technique [0002] According to the notebook computers currently on the market, some of them are equipped with an image capture module on the top of the screen to capture images for communication or image recording. In terms of the overall size of notebook computers, the design trend is light, thin and small, and the pixel value of the image capture module is also required to be higher. At present, the thickness of the thinnest notebook computer casing is only 5mm, which can provide 300,000 pixel images. The installation space of the capture module (including the lens) is only 3.5 mm. According to the current assembly method of the image capture module, the overall thickness of the image capture module with more than 300,000 pixels is relatively large, and the image capture with a larger pixel value Assemblin...

AI Technical Summary

Problems solved by technology

However, the materials of the metal plate 931 and the printed circuit board 932 are different, so there is a significant difference in the number of expansions when heated, and there are also difficulties in adhesion. Therefore, when shaking or vibrating, both the photosensitive element 930 and the printed circuit board 932 will cause displacement, resulting in the fine gold wire 934 being torn off

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