Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply

Abstract

The invention discloses an electronic equipment sealing structure which comprises a shell, wherein a circuit board with an electronic element is arranged in the shell; wire rods are introduced into the shell respectively from two ends of the shell and electrically connected with the circuit board; the shell comprises an upper shell and a cover board; an opening is formed on the bottom surface of the upper shell, and the cover board is covered at the opening of the upper shell; a soft encapsulation glue layer is encapsulated on the upper part of the inner cavity of the upper shell, and at least wraps a board body of the circuit board; and a hard encapsulation glue layer is encapsulated below the soft encapsulation glue layer. According to the electronic equipment sealing structure, a phenomenon of stress damage, caused by encapsulation glue, to the electronic element can be avoided. The invention also discloses an electronic power supply with the electronic equipment sealing structure, and an encapsulation method for the electronic power supply.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a sealing structure for electronic equipment, an electronic power supply with the sealing structure and a potting method for the electronic power supply with the sealing structure. Background technique [0002] For electronic equipment (such as electronic power supply) used outdoors, it is in harsh environments such as sun and rain, wind and rain, lightning, acid rain, humidity, cold and heat shock, etc., so electronic equipment must have a sealed structure with a higher protection level. In order to play the role of waterproof, dustproof, high and low temperature resistance, etc., to avoid damage to electronic equipment caused by external harsh environments. In order to ensure the airtightness of the existing electronic equipment used outdoors, most of the circuit boards with electronic components are arranged in a casing, and then the hard potting glue is used for one-time ...

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Problems solved by technology

[0004] The invention aims to solve the technical problem that the sealing structure of the existing electronic equipment adopts a hard potting glue for one-time potting, which is easy to cause stress damage to the electronic components, and provides a method that can avoid the stress caused by the potting glue to the electronic components. Damage to the sealing structure of electronic equipment

[0005] The present invention also aims to solve the technical problem of insufficient sealing performance existing in the sealing structure of electronic equipment, and provide a sealing structure of electronic equipment with reliable structure and high protection level, which can meet the use requirements of harsh outdoor environments

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