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Golden finger and plate edge interconnection device

A gold finger and edge technology, which is applied in the field of gold finger and board edge interconnection devices, can solve the problems that the copper foil size cannot be increased, and the PCB flow capacity in the gold finger cannot be effectively improved, so as to improve the flow capacity and increase the The effect of the flow channel

Active Publication Date: 2012-07-04
HUAWEI DIGITAL POWER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing technology is restricted by the miniaturization of electronic products, and the copper foil size of the PCB in most gold fingers cannot be increased, resulting in the inability to effectively improve the flow capacity of the PCB in the gold fingers

Method used

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  • Golden finger and plate edge interconnection device
  • Golden finger and plate edge interconnection device
  • Golden finger and plate edge interconnection device

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Embodiment Construction

[0015] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0016] This embodiment provides a gold finger. The gold finger is composed of a multi-layer PCB, and specifically includes a surface layer of the PCB and at least one inner layer of the PCB. In this embodiment, a flow-through structure is designed inside the PCB of the gold finger, and the metal foil on the inner layer of the PCB is...

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Abstract

The embodiment of the invention provides a golden finger and a plate edge interconnection device. The golden finger comprises a PCB surface layer and at least one PCB inner layer, wherein the metallic foils of the PCB inner layer are communicated with the metallic foil on the PCB surface layer through a through flow structure; and the through flow channel of the golden finger comprises the PCB surface layer and the PCB inner layers. The plate edge interconnection device comprises the golden finger. According to the embodiment of the invention, under the premise that the size and thickness of the copper foil in the PCB in the golden finger are not increased, and the through flow channel of the PCB in the golden finger is increased, with greatly improved through flow ability.

Description

technical field [0001] The invention relates to communication technology, in particular to a gold finger and board edge interconnection device. Background technique [0002] With the continuous improvement of the power density of power products, the current flowing in the products gradually increases. It can be seen that power products are developing in the direction of miniaturization, high power and high current. Golden Finger refers to the gold plating on the copper foil on the surface of the printed circuit board (Printed Circuit Board; hereinafter referred to as: PCB) to enhance its wear resistance and improve reliability; The reeds of the connector make contact, which can realize the transmission of signals or energy. It can be seen that the use of the gold finger and the gold finger connector can effectively save the product space and improve the power density of the product. Gold fingers have been widely used in traditional electronic products, such as conductive c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K1/117H05K1/0265H05K2201/0979H05K1/11H05K1/02H05K1/0298H05K3/4046H05K2201/0919H05K2201/09481H05K2201/10416
Inventor 姚凯朱勇发黄应培
Owner HUAWEI DIGITAL POWER TECH CO LTD
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