Detection device used for testing welding pulling force of patch type diode

Abstract

The invention discloses a detection device used for testing welding pulling force of a patch type diode. The detection device includes a push and pull force gauge used for testing pressure and provided with an ejecting block at the lower end, wherein an inverted T-shaped mounting groove is arranged at the upper end of a lifting platform; a lever positioned in a fixing base is positioned with the fixing base through a fixed rotating shaft; a jacking rod is fixed on the lower end surface of the lifting platform; the other end of the jacking rod is positioned above one end of the lever; the other end of the lever is installed below an adjusting screw nut; the adjusting screw nut can drive the lever to rotate around the fixed rotating shaft during vertical movement; the lower end part of an assembly fixing seat is embedded in the inverted T-shaped mounting groove; a dislocation groove positioned at the center of the assembly fixing seat is arranged at the upper end part of the assembly fixing seat; and a first positioning pin and a second positioning pin both positioned on the surface of the upper end part of the assembly fixing seat are arranged on the two sides of the dislocation groove respectively. The detection device provided by the invention can be used for measuring the welding pulling force of a chip and a leading wire frame, has a simple structure, brings convenience foroperation of testing personnel, and can effectively fix the chip and the leading wire frame and guarantee the accuracy of test data, thereby improving the yield.

Description

technical field [0001] The invention relates to the field of semiconductor chip testing, in particular to a detection device for testing the welding tension of patch type diodes. Background technique [0002] In the existing technology, there is no testing device for welding tension on the chip during the manufacturing process of the diode chip. When the chip is put into the diode package, the qualified rate fluctuates greatly, which causes a considerable loss of the company's benefits and causes a waste of social resources. The parameter setting of the existing SMD diode pair welding furnace or the matching of solder is only based on experience, and there is no specific data as a basis. It is inevitable that different parameter settings will be used for diode packages of the same specification under the same equipment conditions. The combination of fixed or different solders will increase the factors that affect the failure of the diode. In addition, if there is no welding...

AI Technical Summary

Problems solved by technology

The structure of the chip is that many metal layers are superimposed. If the metal layer is not firm, the welding tension will be very small, which will also cause the above-mentioned adverse results.

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