Cutting device and method of glass substrate

Abstract

The present invention discloses a glass substrate cutting device, comprising a laser emission device and a cutting device, wherein the laser emission device emits a laser beam on the surface of a glass substrate to be cut to form a microgroove on the glass substrate surface, the cutting device is used for cutting the glass substrate at the position of the microgroove and comprises a cutting wheel fixing device and a diamond cutting wheel fixed on the cutting wheel fixing device. According to the invention, by using the laser emission device to emit the laser beam to form the microgroove on the glass substrate surface, the diamond cutting wheel can be embedded in the microgroove at the position of the microgroove to cut, thus the friction between the diamond cutting wheel and the glass substrate can be increased, the diamond cutting wheel is prevented from sliding when cutting, and the cutting precision is improved.

Description

technical field [0001] Embodiments of the present invention relate to the field of liquid crystal panels, and in particular to a glass substrate cutting device and method. Background technique [0002] At present, the main structure of TFT (Thin Film Transistor: Thin Film Transistor) liquid crystal display panel is an array substrate and a color filter substrate, and the liquid crystal is sandwiched between the two to form a box together. lines and pixel electrodes. The manufacturing process of the liquid crystal display panel mainly includes the array process of the array substrate and the color filter substrate, the box forming process of combining the array substrate and the color filter substrate and dropping the liquid crystal, and the subsequent module process. There are multiple units of liquid crystal display panels on the boxed glass substrate, and the multiple units of liquid crystal display panels are separated by cutting and splitting processes. [0003] For ex...

AI Technical Summary

Problems solved by technology

Among them, the vertical crack 105 is a necessary condition for the subsequent slitting process, but the horizontal crack 104 does not need to be generated, and because of the generation of the horizontal crack 104, there will be redundant glass debris, and the glass debris will adhere to the surface of the glass substrate and the glass. On the circuit in the terminal area of ​​the substrate, the glass surface and the circuit will be scratched or polluted in the subsequent process, which will affect the quality of the product

At the same time, the raised glass debris will also pollute the environment of the dust-free workshop

On the other hand, when the cutter wheel cuts the surface of the glass substrate, it will cause certain wear and tear on the cutter wheel. When the cutter wheel cuts to a certain distance, the life of the cutter wheel will also end, and the cutter wheel needs to be replaced

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