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Method for manufacturing high thermal conductivity metal-base copper-clad plate

A production method and high thermal conductivity technology, applied in the field of circuit boards, can solve the problems of high production cost, inconvenient use, poor interlayer bonding, etc., and achieve the effects of low cost, good interlayer bonding, and simple process

Inactive Publication Date: 2012-06-27
SHAANXI FELDSPAR ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using, tear off the protective film and the release film, and paste it on the metal substrate with special equipment. This method has shortcomings, defects and disadvantages such as high production cost, inconvenient use, and poor interlayer bonding.

Method used

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  • Method for manufacturing high thermal conductivity metal-base copper-clad plate
  • Method for manufacturing high thermal conductivity metal-base copper-clad plate

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specific Embodiment approach 1

[0017] The present invention will be described in detail below in conjunction with the accompanying drawings. As shown in the accompanying drawings:

[0018] A method for manufacturing a high thermal conductivity metal-based copper clad laminate:

[0019] ①. Preparation of high thermal conductivity adhesive: 1.75 kg of halogen-free magnesium hydroxide, 0.75 kg of halogen-free alumina, 0.75 kg of halogen-free boron nitride, 1.0 kg of electronic grade epoxy resin, and 1.0 kg of electronic grade 1.50 kg of acetone and 0.02 kg of electronic-grade dicyandiamide are raw materials, mixed uniformly in a reactor, and prepared into high thermal conductivity adhesive for use;

[0020] ②. Preparation of glue-coated copper foil: use a coating machine to evenly coat the high thermal conductivity adhesive on the back of the copper foil with a coating thickness of 10 μm, and prepare glue-coated copper foil for use;

[0021] ③. Preparation of drying glue-coated copper foil: drying the glue-c...

specific Embodiment approach 2

[0028] Carry out by specific embodiment one, just: in the preparation of high thermal conductivity adhesive, to the consumption of magnesium hydroxide, aluminum oxide, boron nitride, epoxy resin, acetone, dicyandiamide, respectively to reduce 1,2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, and 30 times were implemented, and they were also enlarged by 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, and 30 times were implemented, and all received the expected good results. The present invention has a solid foundation for small-scale experiments, laboratory tests, enlarged tests, and productive tests, and has the operability of theoretical guidance and production application.

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Abstract

The invention relates to a method for manufacturing a high thermal conductivity metal-base copper-clad plate, belonging to the technical field of a circuit board. The method takes high thermal conductivity glue as key technology, and comprises the steps of: spreading the high thermal conductivity glue prepared by magnesium hydroxide, aluminum oxide, boron nitride, epoxy resin, acetone and dicyandiamide on the back of a copper foil, putting the copper foil spread with the high thermal conductivity glue on a metal base plate after drying and cutting, laminating the copper foil on the metal base plate, sticking a protective film on the copper foil, then trimming, examining and packaging, and finally, obtaining the finished product of the high thermal conductivity metal-base copper-clad plate. The high thermal conductivity metal-base copper-clad plate is used for the circuit board of a light-emitting diode (LED) lamp, an igniter, a power supply, a backlight lamp or the like with high power and heat dissipation performance. After the method is adopted, the product quality is good, the cost is low, the technical process is simple, the interlayer binding force is good, and the method is environment-friendly and beneficial to being popularized and applied.

Description

technical field [0001] The invention discloses a method for manufacturing a metal-based copper-clad laminate with high thermal conductivity, and relates to the technical field of circuit boards; in particular, it relates to the technical field of a method for manufacturing a metal-based copper-clad laminate with high thermal conductivity. Background technique [0002] High thermal conductivity metal-based copper clad laminate is composed of copper foil, high thermal conductivity adhesive layer and metal substrate by hot pressing. It is widely used in circuit boards such as high-power and high-heat dissipation LED lamps, igniters, power supplies, and backlight lamps. Metal-based copper clad laminates are divided into two types: ordinary thermal conductivity and high thermal conductivity. The thermal conductivity of ordinary thermal conductivity is less than 0.5W / MK, which is composed of copper foil, dipped prepreg and metal substrate; the thermal conductivity of high thermal c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/06B32B37/10B32B37/12
Inventor 郭长奇
Owner SHAANXI FELDSPAR ELECTRONICS MATERIALS CO LTD
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