Method for packaging wafer level solid-state image sensor

Abstract

The invention provides a method for packaging a wafer level solid-state image sensor. The method comprises the following steps of: etching a microgroove ring array on a silicon wafer to obtain a silicon wafer mold; bonding a boron silicon glass wafer and the silicon wafer mold under vacuum conditions so as to seal the microgroove rings of the silicon wafer mold; heating the bonded wafer to a temperature above a glass softening point and keeping the temperature for a certain period of time, molding the softened glass to obtain a glass bulge loop through atmosphere of an external environment, cooling to solidify the glass and annealing; removing the silicon wafer mold to obtain a glass wafer with a glass bulge loop and a planar optical window; and after alignment, adhering the glass bulge loop and the planar optical window at an end of the glass bulge loop through an adhesive to seal the solid-state image sensor, and obtaining the packaged solid-state image sensor through a back thinning process. The method has the characteristics that: the method has a simple process flow, low cost, controllable height, high degree of parallelism and high yield.

Description

Technical field [0001] The present invention involves a Moems (micro -optical electromechanical system) packaging technology, especially the packaging method of a round -chip -class solid image sensor. Background technique [0002] Nowadays, for mobile terminal devices such as PDA, laptop, and mobile phones, people have played an increasingly important role in product design and manufacturing technology in multi -functional and low -cost needs.In recent years, a micro video camera module has been equipped with a micro -video camera module on mobile phones and other portable consumer electronics.In the mobile phone, in addition to its main features, the camera function is considered by users and mobile phone manufacturers as the core function.The industry has invested a lot of energy to improve and optimize the manufacturing process of mobile phone cameras.Wafer Level Camera is considered a technology that can meet these needs. [0003] The continuous increase in the resolution of...

AI Technical Summary

Problems solved by technology

At present, people usually use thermosetting resin to bond the glass wafer and the silicon wafer to control the distance between the glass wafer and the image sensor chip. Since the thermosetting resin is filled with particles, when making through holes, the particles are easy to contaminate the chip. surface; in addition, when plasma is used to process resin, it is easy to produce by-products to contaminate the surface of the chip, resulting in a significant drop in yield to about 90%; at the same time, it is difficult to control the distance between the glass wafer and the silicon wafer

In addition, it is difficult to control the flatness of the glass wafer and silicon wafer of the image sensor packaged by this method. The patent applicant has developed several preparation methods of wafer-level glass microsphere cavity: positive pressure thermoforming and negative pressure thermoforming method

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