Copper plating method on brass base material
A substrate and copper plating technology, which is applied in the field of electroplating technology, can solve the problems of poor bonding between the coating and the substrate surface, compactness, poor wear resistance and impact resistance, and high energy consumption.
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[0023] The technical solution of the present invention will be further described below in conjunction with a preferred embodiment.
[0024] The method for copper plating on a brass base material involved in the present embodiment comprises the following steps carried out in sequence:
[0025] (1) degreasing process, including the degreasing and degreasing process carried out in sequence, the first electrolytic degreasing process and the second electrolytic degreasing process, wherein,
[0026] The degreasing and degreasing process is as follows: at a temperature of 30-80°C, after immersing the workpiece composed of a brass base material in a commercially available low-foaming degreasing agent solution with a concentration of 2-140g / L, Wash with tap water three times;
[0027] The first electrolytic degreasing process is as follows: at a temperature of 35-45°C, place the workpiece at a current density of 5-10A / dm 2 1. After immersing in a commercially available electrolytic d...
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