Method for preparing composite material

A technology of composite materials and dielectric materials, applied in the direction of electrical components, antennas, etc., can solve the problems of not being able to achieve isotropy, and achieve the effect of achieving isotropy and simple preparation

Active Publication Date: 2013-03-27
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, during the research and practice of the prior art, the inventors found that the metamaterials prepared by the prior art can achieve anisotropy, but not isotropy

Method used

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Experimental program
Comparison scheme
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Embodiment 1

[0022] see figure 2 , is a flow chart of a preparation method of a composite material provided in Embodiment 1 of the present invention, the preparation method comprising:

[0023] S21: Forming a preset array of hemispherical grooves on the first substrate.

[0024] Specifically, CNC machine tools or electric discharge machine tools can be used for processing.

[0025] S22: filling the hemispherical groove of the first substrate with a preset spherical dielectric material, the diameter of the spherical dielectric material being the same as the diameter of the filled hemispherical groove.

[0026] Wherein, the dielectric constant of the spherical dielectric material is greater than that of the first substrate material; the diameter of each spherical dielectric material is on the order of millimeters.

[0027] S23: Forming the same hemispherical groove on the second substrate as the first substrate.

[0028] Wherein, the materials of the second substrate and the first substr...

Embodiment 2

[0033] see image 3 , is a flow chart of a preparation method of a composite material provided in Embodiment 2 of the present invention, the preparation method comprising:

[0034] S31: Forming a preset array of hemispherical grooves on the first substrate. Specifically, CNC machine tools or electric discharge machine tools can be used for processing.

[0035] Wherein, the first substrate is a dielectric material substrate. For example, the material of the first substrate is Teflon.

[0036] S32: filling all the hemispherical grooves of the first substrate with a preset spherical dielectric material, the diameter of the spherical dielectric material being the same as the diameter of the filled hemispherical grooves.

[0037] Wherein, the diameter of each spherical dielectric material is on the order of millimeters; the dielectric constant of each spherical dielectric material is greater than the dielectric constant of the first substrate; the material types of each spherica...

Embodiment 3

[0047] see Figure 4 , is a flow chart of a preparation method of a composite material provided in Embodiment 3 of the present invention, and the preparation method includes:

[0048] S41: Forming a preset array of hemispherical grooves on the first substrate. Specifically, CNC machine tools or electric discharge machine tools can be used for processing.

[0049] Wherein, the first substrate is a dielectric material substrate. For example, the material of the first substrate is Teflon.

[0050] S42: filling the partial hemispherical groove of the first substrate with a preset spherical dielectric material, the diameter of the spherical dielectric material being the same as the diameter of the filled hemispherical groove, and filling air in the remaining part of the hemispherical groove.

[0051] Wherein, the dielectric constant of each spherical dielectric material is greater than the dielectric constant of the first substrate; the material types of each spherical dielectri...

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Abstract

An embodiment of the invention provides a method for preparing a composite material. The method comprises the following steps of: forming a semispherical groove of a preset array on a first substrate; filling a preset spherical dielectric material in the semispherical groove of the first substrate, the diameter of the spherical dielectric material being the same as that of the semispherical groove; forming a semispherical groove the same as that of the first substrate on a second substrate; and splicing the first and second substrates to embed the spherical dielectric material in a spherical cavity formed by splicing the first and second substrates, thereby obtaining the composite material. The composite material is obtained by splicing the spherical dielectric material in the substrates to achieve isotropy and a simple process flow.

Description

【Technical field】 [0001] The invention relates to the technical field of composite materials, in particular to a preparation method of composite materials. 【Background technique】 [0002] Currently commonly used materials are based on the improvement and improvement of the original properties of natural materials, but with the continuous improvement of material design and preparation, the space for further improvement of various properties and functions of natural materials is getting smaller and smaller. Based on this status quo, some composite materials with extraordinary physical properties that natural materials do not possess, such as metamaterials, are produced. People can achieve various physical properties by modulating the structure and key physical scales of various levels of materials, and obtain physical properties that are not possessed by ordered, disordered, or unstructured materials at this level or scale in nature. [0003] In the prior art, the preparation...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q15/00
Inventor 刘若鹏赵治亚缪锡根李春来
Owner KUANG CHI INST OF ADVANCED TECH
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